SiC Super Junction Pillars for Fast Switching and High Breakdown

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor devices using silicon carbide face challenges in achieving high switching speeds while maintaining a balance between breakdown voltage and ON resistance, as existing technologies struggle to optimize impurity concentration profiles for enhanced performance.

Innovation Solution

The semiconductor device employs a super junction structure with alternating n-type and p-type pillars having distinct impurity concentration layers, along with a manufacturing method that involves precise ion implantation and epitaxial growth to form layers with varying impurity concentrations, allowing for improved depletion layer integration and reduced ON resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If silicon carbide is used as the semiconductor material, then the breakdown voltage is improved, but the switching speed is insufficient

Engineering Contradiction:
Improvebreakdown voltageVSAvoidswitching speed
Core Design Contradiction:
StrengthVSSpeed

Solution Approach 1:

The patent applies local quality by creating different impurity concentration profiles in different regions of the semiconductor device. Specifically, the first and second semiconductor layers have different average impurity concentrations (first average concentration and second average concentration), allowing localized optimization of electrical properties to achieve both high breakdown voltage and fast switching speed

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent changes the impurity concentration parameter across different layers and regions. By controlling the impurity concentration to have a first average concentration in the first semiconductor layer and a second average concentration in the second semiconductor layer, the device achieves optimized performance characteristics that resolve the contradiction between breakdown voltage and switching speed

Inventive Principle:
Principle #35Parameter changes

2Speed

If the impurity concentration is increased to reduce ON resistance, then the switching speed is improved, but the breakdown voltage decreases

Engineering Contradiction:
Improveswitching speedVSAvoidbreakdown voltage
Core Design Contradiction:
SpeedVSStrength

Solution Approach 1:

The patent implements local quality by spatially distributing different impurity concentrations in different semiconductor layers. The first semiconductor layer has a first average impurity concentration while the second semiconductor layer has a second average impurity concentration, allowing each region to be optimized for its specific function without compromising the other

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent resolves the contradiction by adding a vertical dimension to the impurity concentration distribution. Instead of uniform concentration throughout, the invention creates a multi-layer structure with different concentration profiles, transforming a one-dimensional problem into a three-dimensional solution space

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables higher breakdown voltage, suppressed ringing of output current, and increased switching speed, while maintaining a strong electric field resistance and reducing manufacturing complexity and costs.

Implementation Method 1

forming an epitaxial layer of the first conductivity type on the first semiconductor layer; forming a second semiconductor layer of the second conductivity type on the epitaxial layer

Methodology Applied
Scientific EffectEpitaxial growth: Epitaxy

Implementation Method 2

injecting impurities of a second conductivity type into a first part of a first semiconductor layer; injecting impurities of the first conductivity type into a second part of the first semiconductor layer

Methodology Applied
Scientific EffectIon implantation: Ion Implantation

Data Source

PatentUS20230299151A1Semiconductor device and method for manufacturing the same
Publication Date: 2023.09.21 KK TOSHIBA
  • US20230299151A1 patent drawing
  • US20230299151A1 patent drawing
  • US20230299151A1 patent drawing

AI summary

A semiconductor device includes a first electrode, a first semiconductor layer of a first conductivity type on the first electrode, a first pillar of a second conductivity type on the first semiconductor layer, the first pillar having a first average concentration of impurities, a second pillar of the first conductivity type on the first semiconductor layer, and including a first layer having a second average concentration of impurities lower than the first average concentration, and a second layer having a third average concentration of impurities higher than the first average concentration, a second semiconductor layer of the second conductivity type on the second pillar, a third semiconductor layer of the first conductivity type on the second semiconductor layer, a second electrode connected to the first pillar and the third semiconductor layer, a third electrode, and an insulating film disposed between the second semiconductor layer and the third electrode.