Susceptor with SiC Base and Coolant Channels for Rapid Thermal Control
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Solution Overview
Problem
Existing substrate processing technologies face challenges in rapidly controlling and responding to temperature changes due to high heat capacity in susceptor materials like aluminum, which hinders efficient microfabrication processes.
Innovation Solution
A substrate processing apparatus with a susceptor featuring a silicon carbide (SiC) base member and a flow passage for coolant, combined with a conductive layer and electrostatic chuck, enhances temperature responsiveness by reducing heat capacity and increasing thermal diffusion, allowing for faster temperature adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the base member is made of aluminum or aluminum alloy with predetermined thickness to ensure mechanical strength, then the mechanical strength is improved, but the heat capacity increases and temperature responsiveness deteriorates
Solution Approach 1:
The susceptor employs a composite structure combining aluminum base member with ceramic coating layers. The aluminum provides mechanical strength while the ceramic layers (alumina and silicon nitride) provide low heat capacity and high thermal conductivity, achieving both structural integrity and rapid temperature responsiveness
Solution Approach 2:
Different regions of the susceptor have different material properties optimized for specific functions: the aluminum base member provides structural support, while the ceramic coating layers on the surface provide thermal management properties. The electrostatic chuck region has additional conductive layers for localized electrical control
2Strength
If the base member thickness is increased to ensure mechanical strength, then the strength is improved, but the time required to bring the susceptor to controlled temperature increases
Solution Approach 1:
The composite structure with thin aluminum base member and ceramic coating layers allows rapid heat transfer to the substrate while maintaining structural strength, reducing the time to reach controlled temperature
Solution Approach 2:
A coolant circulation system with cooling channels is integrated into the base member, allowing rapid removal of heat when temperature reduction is needed, thus reducing the time to reach the desired temperature state
3Temperature
If a coolant flow passage is added to the base member, then the temperature control capability is improved, but the device complexity increases
Solution Approach 1:
The base member serves multiple functions: it provides mechanical support, contains integrated cooling channels for temperature control, and acts as a mounting structure for the ceramic layers and electrostatic chuck, reducing overall device complexity through functional integration
Solution Approach 2:
The cooling channels are merged directly into the base member structure rather than being separate components, and the electrostatic chuck is integrated with the ceramic layers, simplifying the overall device architecture while maintaining temperature control capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves temperature responsiveness, enabling the susceptor to rapidly increase and decrease temperature, thus enhancing the efficiency of microfabrication processes by maintaining precise temperature control.
Implementation Method 1
a first ceramics base member (100a) including a flow passage (102) to let a coolant pass through
Implementation Method 2
The high frequency power source is configured to supply high frequency power to the first conductive layer
Implementation Method 3
an electrostatic chuck stacked on the first conductive layer and configured to electrostatically attract the wafer received thereon
Data Source
AI summary
A susceptor for receiving a substrate, the susceptor including a ceramics base member, a conductive layer formed on a top surface of the ceramics base member and a side surface of the ceramics base member, the top surface of the ceramics base member configured to receive and support the substrate, and a conducting member contacting the conductive layer at an outer surface of the ceramics base member.