Side Acoustic Speaker Waterproofing via Substrate Thickness Variation
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Solution Overview
Problem
The addition of waterproof structures to electronic devices with side acoustic emission speakers deteriorates their acoustic characteristics, particularly in the high-frequency sound range, due to the high linear directivity of high-frequency sounds and the challenges of maintaining sound pressure.
Innovation Solution
The design incorporates a speaker module with a first and second substrate of different thicknesses, where the second substrate has distinct subareas with varying distances and thicknesses to accommodate a waterproof member, forming acoustic emission holes that maintain sound pressure similar to conventional side emission speakers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a waterproof member is added to protect the speaker, then waterproof function is improved, but acoustic characteristics deteriorate
Solution Approach 1:
The second substrate is designed with different thicknesses in different regions: a first thickness in the first subarea and a second thickness in the second subarea. This local variation in thickness compensates for the space occupied by the waterproof member while maintaining proper acoustic emission characteristics in different zones of the speaker assembly.
Solution Approach 2:
The patent changes the thickness parameter of the second substrate to accommodate the waterproof member. By adjusting the substrate thickness in specific areas, the design maintains the necessary acoustic emission hole volume and shape despite the added waterproof structure, thereby preserving acoustic characteristics.
2Volume of moving object
If the second substrate is made thinner to accommodate waterproof member, then device compactness is improved, but sound pressure in high-frequency range deteriorates
Solution Approach 1:
Different regions of the second substrate have different thicknesses to serve different functions. The first subarea has a first thickness optimized for acoustic emission, while the second subarea has a second thickness that accommodates the waterproof member, achieving both compactness and acoustic performance.
Solution Approach 2:
The patent resolves the space conflict by utilizing the thickness dimension of the second substrate. By varying the thickness in the vertical dimension rather than reducing the overall device volume, the design maintains acoustic emission hole volume while achieving compact integration with the waterproof member.
3Reliability
If a waterproof member is added, then reliability is improved, but the volume of acoustic emission hole decreases
Solution Approach 1:
The second substrate's varying thickness creates different zones: the first subarea maintains sufficient distance from the speaker to preserve acoustic emission hole volume, while the second subarea is thinner to accommodate the waterproof member. This local differentiation allows the acoustic emission hole to maintain its volume despite the added waterproof structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the deterioration of acoustic characteristics when a waterproof function is added, ensuring sound pressure is preserved across various frequency bands, including high frequencies.
Implementation Method 1
A space between the waterproof member and the first subarea may include an acoustic emission hole configured to transfer a sound emitted by the speaker to the outside of the electronic device
Data Source
AI summary
The present disclosure relates to an electronic device having a side acoustic emission speaker. The electronic device may include a speaker module accommodated in the electronic device. The speaker module may include a first substrate, a speaker having a lower surface formed on the first substrate, a waterproof member contacting at least one part of an upper surface and at least one part of a first side surface of the speaker, and a second substrate contacting a second side surface of the speaker and overlapping the upper surface of the speaker. The second substrate may include a first subarea displaced from the upper surface of the speaker by a first distance and having a first thickness and a second subarea displaced from the upper surface of the speaker by a second distance and having a second thickness. A space disposed between the waterproof member and the first subarea may include an acoustic emission hole configured to transfer a sound emitted by the speaker to the outside of the electronic device.