Side-Clamping Wafer Chuck for Stable Failure Analysis Conveyance
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Solution Overview
Problem
Existing wafer conveyance mechanisms in semiconductor failure analysis apparatuses face challenges in firmly holding wafers during conveyance without hindering the apparatus's functions, especially when using a wafer conveyance robot, and require a method other than tape fixation.
Innovation Solution
A wafer conveyance unit that includes a fixing unit to position the wafer at a predetermined observation position and a conveyance unit with multiple holding members facing the side surface of the wafer, which sandwiches the peripheral portion of the wafer to securely hold it during conveyance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a fixture is provided on the front surface side of the wafer to hold it during conveyance, then the wafer can be firmly held, but the fixture may interfere with the touch down processing of the probe card needle or damage the needle
Solution Approach 1:
The holding members are positioned to contact the side surface of the wafer rather than the front surface, transitioning the holding location to a different dimension. This allows the wafer to be securely held during conveyance without placing any fixtures on the front surface that would interfere with probe card needle touch down processing
2Adaptability or versatility
If a holding configuration is provided on the back surface side of the wafer to enable solid immersion lens contact, then the entire back surface can be exposed for imaging, but the holding configuration may interfere with conveyance stability
Solution Approach 1:
The holding members contact the side surface of the wafer, utilizing the lateral dimension for securing the wafer during conveyance. This leaves both the front and back surfaces fully accessible for their respective functions (probe card processing and solid immersion lens imaging) while maintaining conveyance stability through side surface engagement
3Reliability
If tape is used to fix the wafer to the wafer chuck, then the wafer can be firmly held during conveyance, but the method becomes incompatible with automated wafer conveyance robots
Solution Approach 1:
The adhesive tape bonding mechanism is replaced with a mechanical holding system consisting of holding members that engage with the wafer's side surface through elastic deformation. This mechanical engagement method is compatible with automated wafer conveyance robots while providing reliable wafer holding during conveyance
Data Source
AI summary
A failure analysis unit is a wafer conveyance unit configured to convey a wafer while holding the wafer in a semiconductor failure analysis apparatus, the wafer conveyance unit including: a placement table configured to fix a wafer at a predetermined observation position; and a wafer chuck configured to convey the wafer while holding the wafer to the observation position. The wafer chuck includes a plurality of holding members (protruding portions) provided so as to face a side surface of the wafer, and holds the wafer by sandwiching a peripheral portion of the wafer W with the plurality of holding members.