Side Conductive Pattern Layout for Reliable Substrate Connections
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Solution Overview
Problem
Current electronic devices face issues such as short-circuiting, open-circuits, and high impedance due to unreliable conductive patterns, which are affected by alignment and formation processes during manufacturing.
Innovation Solution
The electronic device incorporates a side conductive pattern with overlapping portions of different lengths, formed by a conductive layer on the substrate's side and surface, which is patterned to connect with the existing conductive patterns, reducing impedance and improving reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive patterns are used with standard alignment processes, then manufacturing simplicity is maintained, but reliability deteriorates due to short-circuits, open-circuits, and high impedance
Solution Approach 1:
The patent introduces a side conductive pattern that extends from the side surface of the substrate onto the front surface, adding a dimensional aspect to the conductive pattern design. This side extension allows the conductive pattern to overlap with underlying conductive layers, creating multiple overlapping regions that improve reliability by providing redundant electrical pathways and reducing impedance without requiring complex alignment processes.
Solution Approach 2:
The side conductive pattern is divided into multiple segments with different overlapping lengths (first overlapping region with first length, second overlapping region with second length). This segmentation allows each region to be optimized independently for its specific function, improving overall reliability while maintaining manufacturing simplicity through a systematic design approach.
2Reliability
If conductive patterns with uniform overlapping lengths are used, then manufacturing process simplicity is maintained, but reliability deteriorates due to inability to optimize different connection points
Solution Approach 1:
The patent applies different overlapping lengths to different regions of the side conductive pattern. The first overlapping region has a first length optimized for its specific connection requirements, while the second overlapping region has a second length optimized for its requirements. This local differentiation allows each region to achieve optimal electrical connection reliability without requiring high-precision manufacturing control across the entire pattern.
Solution Approach 2:
The side conductive pattern intentionally uses asymmetric overlapping lengths rather than uniform lengths. This asymmetry is designed to match the different electrical requirements at different locations on the substrate, improving overall reliability while the manufacturing process remains relatively simple as it only requires forming the pattern with predetermined different lengths rather than precise alignment.
Data Source
AI summary
Electronic devices and a manufacturing method thereof are provided. The electronic device includes a first substrate having a first surface, a second surface opposite to the first surface, and a side surface between the first surface and the second surface. The electronic device includes a first conductive pattern disposed on the first surface, and a side conductive pattern disposed on the side surface and the first surface. The side conductive pattern is electrically connected to the first conductive pattern. The side conductive pattern includes a first side conductive line and a second side conductive line. A first overlapping portion of the first side conductive line and the first conductive pattern has a first length, a second overlapping portion of the second side conductive line and the first conductive pattern has a second length, and the first length is different from the second length.