Side Contact Pads for High-Speed Memory Card Data Transfer
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Solution Overview
Problem
As memory cards have shrunk in size, there is a need for additional high-speed contact pads to facilitate increased read/write speeds, but the reduced surface area limits the number of contact pads available on traditional surfaces, hindering efficient data transfer.
Innovation Solution
The integration of side contact pads on memory cards, comprising alternating layers of conductive and insulating materials, which extend from the side surfaces to enable high-speed communication by providing additional contact points for electrical coupling with memory card readers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If memory card size is reduced, then portability is improved, but the number of available contact pads decreases
Solution Approach 1:
The patent applies dimensionality change by moving contact pads from traditional top/bottom surfaces to the side surfaces of the memory card. This spatial reconfiguration allows contact pads to be positioned on previously underutilized surfaces, effectively increasing the number of available contact points without increasing the card's footprint area.
2Ease of manufacture
If traditional contact pad arrangement is used, then manufacturing is simple, but data transfer speed is limited
Solution Approach 1:
The invention transitions from two-dimensional contact pad arrangement (top/bottom surfaces) to three-dimensional utilization by incorporating side surfaces. This enables additional high-speed contact pads to be added while maintaining compatibility with existing manufacturing processes for forming conductive and insulating layers.
Solution Approach 2:
The contact pads utilize composite layering of conductive materials (for electrical connection) and insulating materials (for isolation and impedance control). This composite structure enables high-speed data transfer by providing proper signal isolation and impedance matching while maintaining ease of manufacture through standard deposition techniques.
Data Source
AI summary
A memory card includes a memory card body dimensioned to house at least one integrated circuit die package. The memory card body, in certain embodiments, includes a first surface spaced apart from a second surface and a plurality of side surfaces connecting the first surface to the second surface. The memory card also includes a contact pad disposed on at least one side surface of the plurality of side surfaces. The contact pad includes a first conductive layer, a second conductive layer, and an insulating layer disposed between the first conductive layer and the second conductive layer.