Side Coupler Circuit Board for Power Detection
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Solution Overview
Problem
Conventional communication devices require additional space and incur higher costs due to the need for power directional couplers or power-sensing ICs to monitor output power, which also introduce additional insertion loss.
Innovation Solution
A circuit board design incorporating a side coupler that replaces conventional power directional couplers, with a microstrip line and side coupler coupled to generate power for conversion, allowing for adjustable coupling loss to fit desired power detection ranges, thereby reducing board size and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional power directional couplers or power-sensing ICs are installed to monitor output power, then power detection capability is achieved, but board area increases and manufacturing cost increases
Solution Approach 1:
The patent integrates the power detection function directly into the existing microstrip line structure by adding a side coupler, eliminating the need for separate power directional couplers or power-sensing ICs. This merging of functions reduces board area while maintaining power detection capability.
Solution Approach 2:
The side coupler structure serves multiple purposes: it provides power detection capability while being integrated into the existing transmission line architecture. The same structural elements (microstrip line, ground plane, dielectric layer) serve both signal transmission and power monitoring functions.
2Measurement precision
If conventional power directional couplers or power-sensing ICs are installed to monitor output power, then power detection capability is achieved, but manufacturing cost increases
Solution Approach 1:
The power detection function is merged into the existing microstrip line structure using a side coupler approach, eliminating the need for expensive separate power-sensing ICs or power directional couplers. This integration reduces component count and manufacturing cost.
Solution Approach 2:
The side coupler is implemented using standard PCB fabrication techniques with conventional materials (copper traces, dielectric layers, ground planes), replacing expensive specialized components. The structure can be manufactured using standard PCB processes without requiring additional expensive components.
3Measurement precision
If conventional power directional couplers or power-sensing ICs are installed to monitor output power, then power detection capability is achieved, but insertion loss increases
Solution Approach 1:
The power detection function is extracted from separate expensive components and implemented as a coupled structure that takes a portion of the signal through the side coupler. This extraction approach allows power monitoring without requiring the main signal path to pass through lossy directional couplers or sensing ICs.
Solution Approach 2:
The side coupler acts as an intermediary structure that couples energy from the microstrip line to the detection path without requiring the main signal to pass through lossy components. The coupled structure provides a low-loss path for both signal transmission and power detection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the size of the circuit board and manufacturing costs while maintaining negligible insertion loss and significant power detection accuracy, outperforming conventional methods by allowing for adjustable coupling loss to fit desired power detection ranges.
Implementation Method 1
a side coupler disposed on the lower surface and extending into the bottom cavity
Implementation Method 2
a microstrip line disposed on the upper surface and extending into the top cavity
Data Source
AI summary
A communication device includes a circuit board having an upper surface and a lower surface, an upper housing disposed on the upper surface, and a lower housing disposed on the lower surface. The circuit board includes a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity. The upper housing includes a depression corresponding to the top cavity, and the lower housing includes an aperture corresponding to the bottom cavity.


