Side-Discharge Fan Cooling Module for Compact Electronic Chassis
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Solution Overview
Problem
Existing electronic apparatuses face issues with localized high surface temperatures and reduced space efficiency due to the installation of heat sinks behind fans, which occupy valuable internal space and concentrate heat, making it difficult to accommodate other components like batteries.
Innovation Solution
A cooling module with a heat diffusion member and fans having discharge ports on side surfaces facing each other, positioned between the fans, and an exhaust port between them, allowing efficient heat diffusion and air discharge, without the need for heat sinks, thereby improving space utilization and reducing surface temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat sinks are installed behind fans, then heat dissipation is improved, but chassis surface temperature becomes locally high and internal space is reduced
Solution Approach 1:
The patent extracts the heat dissipation function from the traditional heat sink component and relocates it to the fan discharge ports. The fans directly discharge hot air to the outside without requiring heat sinks behind them, thereby eliminating the space occupation of heat sinks while maintaining effective heat dissipation.
Solution Approach 2:
The patent changes the spatial arrangement by positioning discharge ports on the side surfaces of fans rather than requiring rear-facing heat sinks. This dimensional reconfiguration allows hot air to be expelled laterally through the chassis walls, eliminating the need for rear heat sink installation space.
2Temperature
If heat sinks are installed behind fans, then heat dissipation is improved, but chassis surface temperature becomes locally high
Solution Approach 1:
The patent extracts the heat dissipation function from the heat sink and transfers it directly to the fan discharge mechanism. By discharging hot air directly through side ports on the chassis, the heat is removed from the internal space before it can conduct to the chassis surface, eliminating localized high temperature zones.
3Reliability
If heat sinks are installed behind fans, then cooling performance is maintained, but device complexity increases due to space constraints for other components
Solution Approach 1:
The patent removes the heat sink component entirely from the traditional configuration and extracts its heat dissipation function to the fan discharge ports. This simplifies the overall device structure by eliminating unnecessary components and reducing spatial constraints for placing other components like batteries.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses surface temperatures and enhances space efficiency within the chassis, allowing for better integration of components like batteries and antennas, while maintaining cooling performance.
Implementation Method 1
a heat diffusion member that absorbs and diffuses heat from the heat generating element
Implementation Method 2
a pair of fans that are placed with the heat diffusion member located therebetween, and have discharge ports only in side surfaces facing each other, thereby making it possible to discharge air toward the heat diffusion member
Data Source
AI summary
An electronic apparatus includes: a chassis; a heat generating element provided in the chassis; and a cooling module that is provided in the chassis and cools the heat generating element. The cooling module has: a heat diffusion member that absorbs and diffuses heat from the heat generating element; and a pair of fans that are placed with the heat diffusion member located therebetween, and have discharge ports provided only in side surfaces facing each other, thereby making it possible to discharge air toward the heat diffusion member. The chassis has an outer wall that extends along a placement direction of the pair of fans and has an exhaust port formed therein, and the exhaust port is positioned between the pair of fans in the case where the placement direction is taken as a reference.