Side-Drainage Electroplating Bath for Easier Solution Maintenance
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Solution Overview
Problem
The maintenance of liquid outlet holes at the bottom of electroplating baths is inconvenient due to their location, leading to inefficiencies in plating solution management and maintenance.
Innovation Solution
The electroplating bath design incorporates side walls with drainage zones and overflow holes, allowing plating solution to flow through side drainage zones and be discharged from side outlet holes, reducing the need for bottom outlet holes and simplifying maintenance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the liquid outlet hole is formed at the bottom of the electroplating bath, then the plating solution can be drained, but the maintenance of the liquid outlet hole becomes inconvenient
Solution Approach 1:
The patent moves the liquid outlet hole from the bottom (vertical dimension) to the side wall (horizontal dimension) of the electroplating bath. This dimensional change allows maintenance personnel to access and maintain the outlet hole from the side rather than from below, significantly improving maintenance convenience while keeping the drainage function intact.
2Ease of manufacture
If the liquid outlet hole is formed at the bottom of the electroplating bath, then the plating solution can be discharged, but the arrangement and maintenance of the liquid outlet hole becomes complex
Solution Approach 1:
The patent extracts the liquid outlet hole from the bottom structure and relocates it to the side wall. This separation allows the outlet hole to be independently accessed and maintained without disrupting the bottom structure of the electroplating bath, simplifying both the overall structure and maintenance procedures.
3Productivity
If side wall drainage zones and overflow holes are incorporated, then plating solution distribution becomes balanced and maintenance becomes convenient, but the bath structure becomes more complex
Solution Approach 1:
The patent divides the electroplating bath into multiple drainage zones along the side walls, with each zone having its own overflow holes and drainage pathways. This segmentation ensures balanced plating solution distribution across different areas of the bath while organizing the complexity into manageable, modular sections that are easier to design and maintain.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design facilitates convenient maintenance and replacement of the plating solution, ensures balanced plating solution distribution, and maintains film stability during electroplating, enhancing the overall efficiency and quality of the process.
Implementation Method 1
a plating solution overflowed from the first drainage zone 21 is drained to the second drainage zone 31 through the third drainage zone 11 and then discharged
Data Source
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AI summary
The present disclosure relates to an electroplating bath with side walls enabling drainage of a plating solution, and an electroplating production line. The electroplating bath includes a bottom plate, and a first side wall and a second side wall arranged oppositely on the bottom plate. The first side wall is provided with a first drainage zone, and the first drainage zone includes a first side plate with a first overflow hole. The second side wall is provided with a second drainage zone, and the second drainage zone includes a second side plate with a second overflow hole. The second side wall is further provided with a plurality of liquid outlet holes communicating with the second drainage zone, and a height of each of the plurality of liquid outlet holes is lower than a height of the first overflow hole and a height of the second overflow hole. The bottom plate is provided with a third drainage zone, and the third drainage zone communicates with the first drainage zone and the second drainage zone, respectively, and is configured to guide a plating solution in the first drainage zone to the second drainage zone. In the present disclosure, a liquid outlet hole is formed on a side wall, which is convenient to maintenance and replacement of a plating solution.