Side-Edge Mountable Optical Module for High-Density Bandwidth
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Solution Overview
Problem
Existing parallel optical communications systems face limitations in mounting density due to the spatial constraints of traditional mounting configurations, which restrict the increase in bandwidth by limiting the number of modules that can be mounted on a motherboard PCB.
Innovation Solution
The side-edge mountable parallel optical communications module design allows for high-density mounting by using edge card connectors and a metal housing that surrounds the module, enabling the modules to be mounted with a smaller pitch and increasing the overall bandwidth of the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional mounting configurations are used, then the module structure is simple and easy to manufacture, but the mounting density is limited and bandwidth cannot be increased
Solution Approach 1:
The patent transitions from traditional front-panel or mid-plane mounting to side-edge mounting of the module PCB on the motherboard PCB. This dimensional change allows modules to be mounted along the edge of the motherboard, effectively utilizing vertical space and enabling higher mounting density without increasing the horizontal footprint, thus increasing bandwidth while maintaining a compact form factor.
Solution Approach 2:
The module PCB is inserted into a slot formed in the motherboard PCB, creating a nested structure where the module PCB is housed within the motherboard structure. This nesting approach allows for compact integration and high-density mounting of multiple modules along the edge of the motherboard, resolving the contradiction between mounting density and structural complexity.
2Productivity
If more modules are mounted on the motherboard PCB to increase bandwidth, then the bandwidth increases, but the spatial area required increases
Solution Approach 1:
By mounting modules on the side edge of the motherboard PCB rather than on the main surface area, the patent enables multiple modules to be stacked or arranged along the vertical edge dimension. This allows increasing the number of modules (and thus bandwidth) without proportionally increasing the horizontal area of the motherboard PCB.
Solution Approach 2:
The side-edge mounting configuration with slots allows for flexible arrangement and dense packing of modules along the motherboard edge. This dynamic mounting approach enables the system to achieve high bandwidth with optimized space utilization, allowing modules to be closely spaced without requiring excessive motherboard area.
3Productivity
If modules are mounted with smaller pitch to increase mounting density, then the mounting density increases, but the signal integrity and reliability may deteriorate
Solution Approach 1:
The module PCB is inserted into a slot formed in the motherboard PCB, creating a nested structure that provides mechanical support and electrical connection. This slot-based nesting ensures proper alignment and stable electrical connections even when modules are mounted with smaller pitch, maintaining signal integrity while enabling high mounting density.
Solution Approach 2:
The slot structure acts as an intermediary between the module PCB and the motherboard PCB, providing a controlled interface for electrical connections. This intermediary structure ensures reliable signal transmission even when modules are closely spaced, mitigating the potential deterioration of signal integrity that would otherwise occur with smaller pitch mounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables a significant increase in mounting density and bandwidth, allowing for the simultaneous transmission and reception of higher data rates with a smaller footprint on the motherboard PCB, improving the reliability and integrity of digital signals.
Implementation Method 1
The lower side edge of the module PCB has electrical contacts thereon and is disposed within a slot of the first edge card connector such that electrical contacts disposed on the lower side edge of the first module PCB are in contact with electrical contacts of the first edge card connector
Implementation Method 2
The first metal housing acts as an electromagnetic interference (EMI) shield for the first POCM and protects the first module PCB and the first and second POCSMs from the environment
Implementation Method 3
An optics system of the module focuses the optical signals produced by the laser diodes into the ends of respective transmit optical fibers held within a connector that mates with the module
Implementation Method 4
The receive photodiodes convert the incoming optical signals into electrical analog signals
Implementation Method 5
The optics system of the module focuses the light that is output from the ends of the receive optical fibers onto the respective receive photodiodes
Data Source
AI summary
A side-edge mountable parallel optical communications module and an optical communications system that incorporates one or more of the modules are provided. In the optical communications system, one or more of the side-edge mountable parallel optical communications modules are side-edge mounted in respective edge card connectors, which, in turn, are mounted on a surface of a motherboard PCB. Because the modules are relatively thin and because the spacing, or pitch, between the modules can be kept very small, the system can have a very high mounting density, and consequently, a very high bandwidth.