Side-Emitting Optoelectronic Package for Thin Backlight Modules
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Solution Overview
Problem
Current side-emitting light sources in optoelectronic devices are not entirely satisfactory in terms of thickness reduction and light extraction efficiency, necessitating improvements for enhanced performance in backlighting applications.
Innovation Solution
The optoelectronic device incorporates a base with a conductive portion and coupling surfaces, a light-emitting chip, an interposer, a wavelength conversion member, and a wall portion, where the emitting surface is parallel to the top surface and perpendicular to the coupling surfaces, allowing for high-precision electrical connections and reduced thickness through metal deposition and molding processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If side-emitting light sources are used to reduce backlight module thickness, then the thickness is reduced, but the light extraction efficiency is insufficient
Solution Approach 1:
The patent transitions from conventional top-emitting LED architecture to side-emitting LED architecture, changing the light emission direction from vertical to lateral. This dimensional change allows the light to exit through the side of the package rather than the top, enabling thinner backlight module design while maintaining effective light extraction through optimized side-emission geometry and phosphor conversion layers.
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions of the LED package. The side-emitting structure uses specific phosphor materials and encapsulation materials with optimized optical properties in different zones to enhance light extraction efficiency locally, addressing the contradiction between thinness and light extraction performance.
2Quantity of substance
If multiple light-emitting chips are arranged to increase chip density, then chip density per unit area increases, but device complexity increases
Solution Approach 1:
The patent integrates multiple functional components into a unified side-emitting LED package structure. The light-emitting chip, phosphor materials, encapsulation material, and electrical connections are combined into a single integrated package that emits light from the side, allowing multiple chips to be arranged efficiently without proportionally increasing overall device complexity.
Solution Approach 2:
The side-emitting LED package structure serves multiple functions simultaneously: it provides light emission, wavelength conversion through phosphor, optical guidance, and structural support. This multi-functionality reduces the need for separate components when arranging multiple chips, thereby increasing chip density without linearly increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light extraction efficiency and concentration while reducing the overall device thickness, improving adhesion and reliability, and enabling higher chip density per unit area.
Implementation Method 1
A wavelength conversion member covers the light-emitting chip and the interposer. The wavelength conversion member includes an emitting surface
Data Source
AI summary
The present disclosure provides an optoelectronic device including a base, a light-emitting chip, an interposer, a wavelength conversion member and a wall portion. The base includes a base portion and a conductive portion, and the conductive portion comprises a plurality of coupling surfaces. The base portion covers the conductive portion and exposes the coupling surfaces. The light-emitting chip and the interposer are provided on the base, and having a top surface. The interposer covers the light-emitting chip and exposes the top surface. The wavelength conversion member covers the light-emitting chip and the interposer, and the wavelength conversion member includes an emitting surface. The wall portion is provided on the base. The wall portion covers the interposer and the wavelength conversion member, and exposes the emitting surface of the wavelength conversion member. The emitting surface is parallel to the top surface, and perpendicular to the coupling surfaces.