Side-Emitting LED Package With Concave Molded Part
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Solution Overview
Problem
Conventional side-emitting LED packages suffer from light scattering upward, limited productivity due to complex manufacturing processes, and are not easily adaptable to compact designs required by slimmer LCD backlight units.
Innovation Solution
A side-emitting LED package with a substrate, a molded part having a concavely depressed center, and a reflective layer covering the entire upper surface to prevent upward light scattering, manufactured using PCB processes and Epoxy Molding Compound transfer molding, allowing for efficient light reflection and mass production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a conventional side-emitting LED package structure with a lens is used, then light can be emitted, but light scatters upward and the package thickness increases
Solution Approach 1:
The patent inverts the conventional approach by placing the light-transmitting surface on the side of the package rather than on the top. The molded part is designed with a flat upper surface and light emission occurs through the side surface, effectively inverting the emission direction from upward to sideward, thereby reducing package thickness while maintaining light emission functionality
Solution Approach 2:
The patent converts the harmful upward light scattering into a beneficial feature by using the flat upper surface as a reflective surface. The reflective layer on the flat upper surface redirects upward-scattered light toward the side emission direction, turning what was previously waste light into useful sideward-emitted light
2Ease of manufacture
If a reflective layer is formed only on some portion of the center of the molded part, then manufacturing is simplified, but light reflection efficiency is reduced
Solution Approach 1:
The patent applies local quality by creating a depression in the molded part that concentrates the reflective layer in a specific local area (the depressed center region). This allows the reflective layer to be formed only where it is most needed for redirecting light, simplifying manufacturing while maintaining high reflection efficiency through optimized placement rather than full-surface coverage
3Reliability
If lead terminals are used to mount LED chips, then electrical connection is achieved, but productivity per hour decreases
Solution Approach 1:
The patent merges the electrical connection function and the mechanical mounting function into a single integrated substrate structure. The substrate directly mounts the LED chip without requiring separate lead terminals, combining multiple functions into one component and eliminating the time-consuming lead terminal attachment process, thereby significantly improving productivity while maintaining reliable electrical connection
4Productivity
If a conventional manufacturing process is used, then production is achievable, but color dispersion increases and mass production efficiency is reduced
Solution Approach 1:
The patent replaces manual or semi-automatic manufacturing processes with automated injection molding technology. The molded part is formed through injection molding that integrates the substrate, LED chip mounting structure, and reflective surface formation in a single automated process, eliminating manual assembly steps that cause color dispersion while achieving high-volume mass production efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reflects light sideward, enhances productivity, and enables compact, thin package designs suitable for slimmer LCD backlight units, with improved optical properties and color consistency.
Implementation Method 1
a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part
Data Source
AI summary
The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.