Side-emitting LED Package Scattering Area Backlight
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Solution Overview
Problem
Conventional side-emitting LED packages require reflecting paper to redirect upward-emitted light, leading to weak bonding, increased manufacturing time and cost, and light loss, as well as thickness issues in backlight devices due to the need for precise distances between components.
Innovation Solution
Applying a scattering material with fine particles and a binder on the reflecting surface of the LED package to scatter and redirect upward-emitted light, eliminating the need for reflecting paper and allowing for more efficient light distribution without increasing device thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If reflecting paper is attached to redirect upward light, then light distribution is improved, but bonding strength decreases and manufacturing complexity increases
Solution Approach 1:
The patent combines the reflecting surface and scattering function into a single integrated structure. The inner wall of the package cavity serves as both the light reflection surface and the scattering structure, eliminating the need for separate reflecting paper attachment. This merging resolves the bonding strength issue while maintaining light distribution uniformity through the scattered light effect.
Solution Approach 2:
The patent introduces a scattering structure as an intermediary element on the light exit surface. This scattering structure mediates between the LED chip and the external environment, scattering the light to achieve uniform distribution without requiring additional reflecting paper layers, thus avoiding bonding issues.
2Loss of energy
If reflecting paper is attached to redirect upward light, then light loss is reduced, but manufacturing time and cost increase
Solution Approach 1:
The patent merges the scattering function directly into the package structure's inner wall, eliminating the need for separate reflecting paper attachment steps. This integration reduces manufacturing time and cost while maintaining effective light redirection and reducing light loss through the scattered light mechanism.
Solution Approach 2:
The package structure itself provides the scattering function through its designed inner wall geometry, making the structure self-sufficient for light redistribution. This eliminates the need for additional components and manufacturing steps, improving productivity while maintaining energy efficiency.
3Illumination intensity
If precise distances are maintained between backlight components, then light uniformity is achieved, but device thickness increases
Solution Approach 1:
The patent transitions from controlling light uniformity through spatial distance (z-dimension) to controlling it through surface geometry (x-y plane). The scattering structure on the inner wall scatters light in multiple directions, achieving uniform distribution without requiring precise vertical spacing between components, thus reducing overall device thickness.
Solution Approach 2:
The patent applies local scattering properties at specific locations on the inner wall to achieve global light uniformity. By designing the inner wall geometry with specific scattering characteristics at different positions, the patent achieves uniform light distribution without requiring uniform large distances throughout the device, thereby reducing thickness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances light-emitting efficiency by scattering upward light to achieve uniform intensity, reduces manufacturing complexity and costs, and allows for a thinner, more reliable backlight device by eliminating the need for precise distance adjustments.
Implementation Method 1
a scattering area formed on the reflecting surface... scattering material applied on a reflecting surface... to scatter and redirect upward-emitted light
Data Source
AI summary
The invention provides an LED package and a backlight device incorporating the LED lens. The LED package has a bottom surface and a light exiting surface cylindrically extended around a central axis of the package from the bottom surface. Also, a reflecting surface is positioned on an opposite side of the bottom surface and symmetrical around the central axis such that light incident from the bottom surface is reflected toward the light exiting surface. Further, a scattering area is formed on the reflecting surface. According to the invention, by applying scattering materials on the reflecting surface of the LED package, a reflecting paper does not need to be attached, thereby simplifying a process and reducing the manufacture time and cost.