Side-Emitting LED Strip With Reflective Encapsulation
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Solution Overview
Problem
Conventional flexible LED light strips do not effectively diffuse light or manage heat, leading to non-uniform illumination and potential overheating, which can be aesthetically and functionally suboptimal.
Innovation Solution
A side-emitting LED lighting strip with a flexible printed circuit board and an encapsulation structure made of a polymer material that diffuses light and includes a reflective portion to redirect and disperse light and heat, using a reflective material such as white reflective film or paint applied to the encapsulation structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If conventional flexible LED light strips are used, then the structure is simple and easy to manufacture, but the light diffusion is ineffective and heat management is poor
Solution Approach 1:
The encapsulation structure is divided into multiple functional zones: a light-emitting zone with diffusing properties and a heat management zone with reflective properties. This segmentation allows each zone to perform its specific function optimally while maintaining overall structural simplicity
Solution Approach 2:
The encapsulation structure serves multiple functions simultaneously: it protects the LED, diffuses light in the light-emitting zone, and reflects heat in the heat management zone. This multi-functionality improves performance without requiring separate components
2Temperature
If conventional LED strips without reflective portions are used, then the manufacturing process is simple, but heat management is ineffective
Solution Approach 1:
The encapsulation structure has different optical properties in different regions: the light-emitting zone has diffusing properties while the heat management zone has reflective properties. This local differentiation addresses specific functional requirements in different areas without complicating the overall manufacturing
3Temperature
If the encapsulation structure uses thick reflective material, then heat reflection is improved, but the device size increases
Solution Approach 1:
The reflective portion uses a thin layer of reflective material with optimized thickness and optical properties to achieve effective heat reflection. By changing the material parameters (reflectivity, thickness) rather than increasing overall structure size, heat management is improved while maintaining compact dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides uniform illuminance and effective heat management, enhancing the aesthetic appeal and operational efficiency of the lighting strip by diffusing between 50% to 90% of the emitted light and maintaining high reflectivity for visible light.
Implementation Method 1
an encapsulation structure disposed over the flexible printed circuit board having a reflective side and a light emission side opposite of the reflective side
Implementation Method 2
a reflective portion disposed over the reflective side of the encapsulation structure, and the emitting portion of the light emitting diode is oriented to emit light towards the reflective side
Implementation Method 3
The polymer material includes a coefficient of thermal expansion (CTE) ranging from one hundred and seventy (170) in/in C.° to one hundred and eighty (180) in/in C.°
Implementation Method 4
The polymer material includes a coefficient of thermal expansion (CTE) ranging from one hundred and seventy (170) in/in C.° to one hundred and eighty (180) in/in C.°
Data Source
AI summary
A light emitting diode device is disclosed. The light emitting diode device includes a flexible printed circuit board having at least one light emitting diode mounted thereon. The at least one light emitting diode includes an emitting portion configured to emit light. The light emitting diode device also includes an encapsulation structure disposed over the flexible printed circuit board having a reflective side and a light emission side opposite of the reflective side. The light emitting diode also includes a reflective portion disposed over the reflective side of the encapsulation structure, and the emitting portion of the light emitting diode is oriented to emit light towards the reflective side.