Side-Exposed Electrode Wiring Board for Miniaturized Image Pickup
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Solution Overview
Problem
Current image pickup apparatuses with wafer level chip size packages face challenges in reducing size, particularly diameter, for applications like endoscopes, where compact designs are required, and existing wiring boards lack reliable and efficient methods for external connection and signal transmission.
Innovation Solution
A wiring board with multiple conductive electrode members exposed on side surfaces, which are integrated into a multilayer structure with wiring and insulating layers, enabling external connection to the image pickup device chip and wiring cable, and a manufacturing method that involves cutting a substrate to expose these electrode members for secure and reliable connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional wiring boards are used with wafer level chip size packages, then the image pickup apparatus can be miniaturized, but the connection reliability and external connection efficiency deteriorate
Solution Approach 1:
The patent transitions electrode connections from traditional top-surface mounting to side-surface exposure. By incorporating electrode members that extend through the wiring board and exposing them on the side surface, the connection interface is moved to a different spatial dimension, enabling compact packaging while maintaining reliable external connections.
Solution Approach 2:
The electrode members are pre-incorporated into the wiring board during manufacturing, positioned to extend through the board thickness. This preliminary positioning ensures that when the wiring board is cut to final dimensions, the electrodes are already in their correct exposed positions, eliminating the need for post-manufacturing alignment or additional connection steps.
2Volume of moving object
If the wiring board is cut to reduce size, then miniaturization is achieved, but the electrode members may not be properly exposed or positioned
Solution Approach 1:
The electrode members are pre-positioned and fixed within the wiring board structure before the cutting process. This preliminary fixation ensures that when the board is cut to final dimensions, the electrodes remain in their correct relative positions and are properly exposed on the side surface, maintaining manufacturing precision despite size reduction.
Solution Approach 2:
The patent combines multiple functions into the electrode members: they serve as both internal connection elements within the multilayer wiring structure and as external connection terminals. By merging these functions into a single integrated component, the design eliminates the need for separate internal traces and external terminals, simplifying the manufacturing process and improving precision.
Data Source
AI summary
A wiring board includes a plurality of wiring layers, a plurality of insulating layers, and an electrode member made of a conductive material, the electrode member being incorporated in the wiring board in a state in which the electrode member includes exposed sections on side surfaces that cross the plurality of wiring layers and the plurality of insulating layers.