Side-Exposed Heat Dissipation Member for Electronic Device Thermal Management
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in efficiently dissipating heat generated internally to the outside without transferring it to areas where users typically touch, leading to potential discomfort and reduced device performance.
Innovation Solution
Incorporating a heat dissipation member with higher thermal conductivity than the front and back surfaces of the device, exposing it on side surfaces to absorb and direct heat away from the device, while ensuring the exposed surface is positioned further inside to avoid user contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high thermally conductive component is provided inside the housing cover to make the temperature uniform, then the temperature distribution is improved, but the user may feel heat discomfort at touched locations
Solution Approach 1:
The patent applies local quality by creating an asymmetric heat dissipation structure where the heat dissipation member is exposed at specific locations (side surfaces and bottom) that are less likely to be touched by users, while keeping the front surface insulated. This allows different regions of the device to have different thermal characteristics - high heat dissipation at non-contact areas and low heat transfer at user-contact areas - thereby resolving the contradiction between temperature uniformity and user comfort
2Loss of energy
If heat is conducted efficiently to the outside, then heat dissipation performance is improved, but heat may be transferred to areas where users touch
Solution Approach 1:
The patent uses the housing cover as an intermediary element that mediates between the heat-generating components and the user's hand. The heat dissipation member is strategically positioned within the housing cover structure, using the cover itself as a thermal management intermediary that directs heat away from user contact areas while still achieving efficient heat dissipation to the environment
3Loss of energy
If the heat dissipation member is exposed on side surfaces, then heat dissipation is improved from non-contact areas, but the structural complexity increases
Solution Approach 1:
The patent applies multi-functionality by designing the heat dissipation member to serve multiple purposes simultaneously: it acts as both a thermal management component and a structural element of the housing. The heat dissipation member is integrated into the housing cover structure, allowing it to fulfill both thermal dissipation functions and structural support roles, thereby reducing overall device complexity while achieving effective heat dissipation from side surfaces
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively conducts heat generated inside the device to the outside from areas not typically touched by users, reducing user discomfort and maintaining component performance and longevity.
Implementation Method 1
the heat dissipation member is exposed on at least one of a plurality of side surfaces of the electronic device so as to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat to an outside of the electronic device
Data Source
AI summary
Provided is an electronic device including a metal plate that is exposed on at least one of a plurality of side surfaces of the electronic device so as to absorb heat from a heat generating component that generates heat inside the electronic device and guide the heat to an outside of the electronic device. In addition, an outer surface of the metal plate exposed to the outside is formed further inside the electronic device than a first member and a second member.