Side Heat Dissipator Package Structure for Chip Warpage Control
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently dissipating heat generated by high-power chips due to the low thermal conductivity of silicon, leading to warpage and pseudo soldering issues when chips are thinned to improve heat dissipation.
Innovation Solution
A side-heat-dissipation-enhanced package structure that includes a side heat dissipator made of a heat-conducting material, electrically connected to the chip's circuit layer, to enhance heat transfer and reduce warpage by increasing the chip's strength and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the chip is thinned to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but warpage and pseudo soldering issues occur
Solution Approach 1:
The patent introduces a lateral heat dissipation dimension by attaching a heat dissipator to the side surface of the chip. Instead of only thinning the chip in the vertical direction, heat is conducted sideways through the heat dissipator to a heat dissipation structure, creating a new heat dissipation pathway in the lateral dimension. This resolves the contradiction by improving heat dissipation without compromising chip integrity.
Solution Approach 2:
The heat dissipation function is segmented into multiple independent pathways: vertical heat dissipation through the substrate and lateral heat dissipation through the side heat dissipator. This segmentation allows the chip to maintain its original thickness while achieving improved heat dissipation through the lateral pathway, avoiding warpage and soldering issues.
2Length of moving object
If the chip is thinned to reduce thickness, then heat dissipation path is shortened, but chip strength decreases leading to warpage
Solution Approach 1:
The patent adds a lateral heat dissipation dimension through the side heat dissipator, allowing heat to escape horizontally rather than requiring vertical thinning. This enables the chip to maintain its original thickness and structural strength while achieving effective heat dissipation through the lateral pathway.
3Power
If high power consumption is increased to improve chip performance, then chip performance is improved, but heat generation increases
Solution Approach 1:
The heat dissipation system is segmented into multiple independent pathways: vertical heat dissipation through the substrate and lateral heat dissipation through the side heat dissipator. This segmentation provides redundant heat dissipation channels, allowing the chip to handle higher power consumption and heat generation without temperature runaway.
Solution Approach 2:
The patent introduces lateral heat dissipation as an additional dimension to the traditional vertical heat dissipation pathway. This multi-dimensional heat dissipation approach enables the chip to manage higher power consumption by distributing heat flow across multiple pathways, preventing thermal accumulation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The side heat dissipator improves heat dissipation efficiency and reduces warpage, allowing for thinner and lighter chips with enhanced thermal management.
Implementation Method 1
a side heat dissipator on a side of the chip, the side heat dissipator including a heat conduction material
Implementation Method 2
the side heat dissipator may be electrically connected to a circuit layer of the chip
Data Source
AI summary
Provided is a package structure, including a substrate, a chip on the substrate in a flip-chip manner, the chip including a circuit layer, and a side heat dissipator on a side of the chip, the side heat dissipator comprising a heat conduction material, wherein the side heat dissipator is electrically connected to the circuit layer.