Side-Inserted Connecting Pin for Automotive LED Heat Dissipation
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Solution Overview
Problem
Existing light-emitting devices for automotive applications face challenges in design and manufacturing complexity, particularly in efficiently supporting and connecting light-emitting diodes (LEDs) while ensuring reliable electrical and thermal conductivity.
Innovation Solution
A light-emitting apparatus featuring a supporting element with a bended connecting pin that inserts from the side and electrically connects to conductive pads on the LED, providing a slim design and simple manufacturing process, with the connecting pins made of flexible metallic materials for effective heat dissipation and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional mounting methods are used for LED in automotive lamps, then reliable electrical connection can be achieved, but the lamp size and design flexibility are limited
Solution Approach 1:
The patent combines the electrical connection function and mechanical mounting function into a single integrated LED component structure. The LED chip is directly mounted on the circuit board with integrated contact pads that serve both as electrical conductors and mechanical attachment points, eliminating the need for separate mounting brackets, screws, or clips that would increase device complexity and reduce design flexibility.
2Ease of manufacture
If conventional electrical connection methods are used, then stable electrical conductivity can be achieved, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The LED chip is pre-mounted on the circuit board during the PCB manufacturing process itself, before final assembly. The contact pads are pre-formed and positioned on the board, allowing the LED to be directly attached and electrically connected in a single step during board fabrication, rather than requiring separate connection steps later in the manufacturing process.
3Productivity
If LED is directly mounted on supporting element, then manufacturing process is simplified, but heat dissipation efficiency may be reduced
Solution Approach 1:
The patent introduces a thermally conductive adhesive or intermediate layer between the LED chip and the supporting element. This intermediary material serves dual purposes: it provides mechanical bonding to simplify the manufacturing process, and it acts as a thermal pathway to efficiently conduct heat away from the LED chip to the heat sink or supporting structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient energy transfer and heat dissipation, enhancing the reliability and longevity of automotive LED lamps while simplifying the manufacturing process and offering design flexibility.
Implementation Method 1
The connecting pin is inserted from the side surface of the supporting element and electrically connected to one of the conductive pads
Implementation Method 2
the connecting pins made of flexible metallic materials for effective heat dissipation and electrical conductivity
Data Source
AI summary
A light-emitting apparatus includes a supporting element, a light-emitting device, and a connecting pin. The light-emitting device has a pair of conductive pads and is disposed on the supporting element. The connecting pin is inserted from the side surface of the supporting element and electrically connected to one of the conductive pads. The topmost surface of the supporting element is lower than the top surface of the light-emitting device.