Side Mount Feedthrough for Implantable Medical Devices
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Solution Overview
Problem
Existing electrical feedthrough assemblies for implantable medical devices require complex bending of circuit boards and connectors, leading to manufacturing challenges, increased device size, and potential structural integrity issues due to the radial mounting of feedthrough apertures, which complicates connections between sealed components and main circuit boards.
Innovation Solution
The development of side mount feedthrough assemblies with apertures on the lateral side of the encasement, allowing terminal conductors to pass through without bending, enabling direct connections to the main circuit board without flex circuits or wire bends, and utilizing insulators and ferrules to ensure secure and reliable interconnections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If radial mounting of feedthrough apertures is used, then electrical access to sealed components is achieved, but complex bending of circuit boards and connectors is required
Solution Approach 1:
The feedthrough aperture is repositioned from a radial mounting configuration to a lateral side mounting configuration. This dimensional change in aperture location eliminates the need for complex bending of circuit boards and connectors, as the terminal conductor can extend directly from the lateral side of the encasement to the circuit board in a straight line, thereby reducing device complexity while maintaining electrical access reliability
2Reliability
If radial mounting of feedthrough apertures is used, then electrical connection is established, but manufacturing complexity increases
Solution Approach 1:
By relocating the feedthrough aperture to the lateral side of the encasement rather than using radial mounting, the terminal conductor can be directly connected to the circuit board without requiring complex bending operations during assembly. This dimensional repositioning simplifies the manufacturing process, reduces assembly steps, and lowers manufacturing complexity while ensuring reliable electrical connection between the battery and circuit board
3Reliability
If radial mounting of feedthrough apertures is used, then feedthrough assembly is completed, but device size increases
Solution Approach 1:
The lateral side mounting of the feedthrough aperture allows the terminal conductor to extend directly from the encasement to the circuit board without requiring additional space for bends or flex circuits. This dimensional change in aperture positioning optimizes the spatial arrangement of components, reducing the overall device volume while maintaining reliable feedthrough assembly
4Reliability
If radial mounting of feedthrough apertures is used, then electrical access is provided, but structural integrity is compromised
Solution Approach 1:
By positioning the feedthrough aperture on the lateral side of the encasement rather than using radial mounting, the terminal conductor can be installed in a straight configuration without bending. This eliminates stress concentration points that would otherwise compromise the structural integrity of the conductor and encasement, thereby maintaining both electrical access and mechanical strength
5Ease of manufacture
If lateral side aperture is used, then terminal conductor connection is simplified, but encasement design changes
Solution Approach 1:
The encasement is segmented into distinct functional zones: the lateral side contains the feedthrough aperture for terminal conductor access, while the radial sides maintain their traditional structure for other component interfaces. This segmentation allows the terminal conductor connection to be simplified through lateral mounting without fundamentally redesigning the entire encasement geometry, thereby reducing manufacturing complexity while maintaining design coherence
Data Source
AI summary
The present subject matter provides apparatus and methods for manufacturing an encasement for a component of an implantable medical device having a main circuit board. The method includes forming an encasement aperture on a lateral side of the encasement. The lateral side of the encasement is adapted to be placed substantially parallel to a surface of the main circuit board. A feedthrough assembly is connected through the encasement aperture. The feedthrough assembly includes at least one terminal conductor at least partially passing through the encasement aperture.