Side-Mounted Connection Pads for Display Substrate Wiring Protection
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Solution Overview
Problem
Display devices face issues with wiring damage and image quality due to curved or bent wirings in the non-display areas, which affect the connection between substrates.
Innovation Solution
A display device design featuring connection pads attached to the side surfaces of the display device, specifically including upper and lower pad areas made of silver, to connect substrates without exposing wirings, thereby preventing damage and ensuring secure connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wirings are curved or bent to connect substrates in non-display areas, then connection between substrates is achieved, but wiring damage occurs and display image quality deteriorates
Solution Approach 1:
The connection pad extends from the side surface of the display substrate into the non-display area, utilizing the third dimension (depth/thickness) to create a connection path that avoids the problematic curved wiring configuration while maintaining electrical connectivity between substrates
2Reliability
If connection pads are attached to side surfaces to prevent wiring damage, then wiring integrity is improved, but device structure becomes more complex
Solution Approach 1:
The connection pad integrates multiple functions into a single structure: it provides electrical connection, mechanical support, and protection for the wiring in the non-display area, thereby reducing the need for separate protective structures and minimizing overall device complexity
Solution Approach 2:
The connection pad acts as an intermediary element between the display substrate and the lower substrate, providing a stable connection interface that protects the wiring while maintaining signal transmission, thus resolving the conflict between connection stability and structural simplicity
Data Source
AI summary
A display device includes a display substrate that has a bent portion, a driving chip, and a first connection pad that connects the display substrate and the driving chip disposed on one side surface of the display substrate and that includes an upper pad area and a lower pad area. The display device connects substrates without exposing wirings by attaching the connection pad on the side surface of the display device.