Side-Mounted Circuit Substrate Layout for Narrow-Bezel Displays
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Solution Overview
Problem
Conventional display devices have a limited display area due to the presence of non-display areas occupied by circuit substrates and connection pads, which restricts the expansion of the image display area.
Innovation Solution
The display device incorporates a substrate with etched portions and connection electrodes on the side surfaces, allowing the circuit substrates to be mounted on the side surfaces instead of the top surface, thereby reducing the non-display area and increasing the display area. This design includes signal lines and connection electrodes on the upper surface, with etched portions extending from the side surfaces to facilitate electrical connections without occupying the top surface space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the circuit substrate is mounted on the top surface of the display panel, then the electrical connection between the display panel and driving chip is achieved, but the non-display area increases and the display area is reduced
Solution Approach 1:
The circuit substrate is relocated from the top surface (2D plane) to the side surface of the display panel, utilizing the third dimension (vertical space) to resolve the conflict between display area and electrical connection requirements. This dimensional transition eliminates the need for non-display areas on the top surface while maintaining functional connectivity through side-surface mounting structures.
2Area of stationary object
If the circuit substrate is mounted on the side surface of the display panel, then the display area is increased, but the manufacturing process becomes more complex
Solution Approach 1:
The electrical connection structure is segmented into multiple components: connection electrodes on the side surface, conductive adhesives for bonding, and etched portions for signal line routing. This segmentation allows each component to be optimized and manufactured separately using existing technologies, reducing overall manufacturing complexity despite the innovative side-surface mounting approach.
3Reliability
If etched portions are created on the side surface, then the connection between signal lines and circuit substrate is improved, but the structural integrity may be compromised
Solution Approach 1:
The etched portions are created only in specific localized areas of the side surface where electrical connections are required, rather than throughout the entire structure. This localized modification maintains the structural integrity of the bulk material while providing the necessary pathways for signal lines and connection electrodes, thus balancing electrical reliability with mechanical strength.
Data Source
AI summary
A display device includes a substrate of a display panel, including: a display area and a non-display area, an upper surface and a lower surface each in the display area and the non-display area, and side surfaces connecting the upper and lower surfaces to each other; a signal line on the upper surface of the substrate; a circuit substrate on a side surface of the substrate; and a connection electrode on the upper surface of the substrate in the non-display area thereof, where the connection electrode electrically connects the signal line and the circuit substrate to each other. In the non-display area, the substrate further includes: a first etched portion recessed from the side surface at which the circuit substrate is disposed, and a second etched portion extending from the first etched portion toward the signal line, and the connection electrode is in the first and second etched portions.