Side-Mounted Interposer Substrate for Circuit Assembly

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Solution Overview

Problem

The increasing demand for fast, reliable, and high-performance electronic products requires reducing communication distance and wiring footprint among electronic components on circuit boards, which existing technologies fail to achieve effectively while maintaining reliability.

Innovation Solution

An electronic circuit assembly is created by using an interposer substrate with a lower coefficient of thermal expansion (CTE) and a wiring substrate with a higher CTE, where electronic components are mounted on the side surface of the interposer substrate, reducing communication distance and enhancing reliability through a method involving bonding, cutting, and forming conductive blind holes and electrical connective parts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If electronic components are mounted on the upper/lower surface of the circuit board, then the assembly is simple, but the communication distance and wiring footprint are large

Engineering Contradiction:

Improveassembly simplicityVSAvoidcommunication distance

Core Design Contradiction:

Device complexityVSLength of moving object

Solution Approach 1:

The patent transitions from mounting electronic components only on the upper/lower surfaces (2D mounting) to mounting components on the side surface (3D mounting). This dimensional change allows components to be positioned closer together, reducing communication distance and wiring footprint while maintaining assembly feasibility through the interposer substrate structure.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Ease of manufacture

If substrate with high CTE is used, then the manufacturing is easier, but the reliability under temperature changes deteriorates

Engineering Contradiction:

Improvemanufacturing easeVSAvoidreliability under temperature changes

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the CTE parameter of the substrate by introducing an interposer substrate with low CTE (such as silicon or ceramic) between the wiring substrate and the electronic component. This parameter change ensures that the substrate near the component has low CTE to match the component's thermal expansion characteristics, improving reliability under temperature changes while the overall assembly remains manufacturable.

Inventive Principle:

Principle #35Parameter changes

3Length of moving object

If electronic components are mounted on the side surface, then the communication distance is reduced, but the manufacturing complexity increases

Engineering Contradiction:

Improvecommunication distanceVSAvoidmanufacturing complexity

Core Design Contradiction:

Length of moving objectVSDevice complexity

Solution Approach 1:

The patent introduces an interposer substrate as an intermediary element between the wiring substrate and the electronic component. This interposer serves as a mediator that enables side-surface mounting by providing a platform with appropriate CTE and electrical connection capabilities, thereby reducing communication distance while managing the manufacturing complexity through a modular structure.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent segments the substrate system into multiple independent parts: the wiring substrate, the interposer substrate, and the electronic component. This segmentation allows each part to be optimized independently (wiring substrate for signal routing, interposer for thermal expansion matching and side mounting), reducing the overall manufacturing complexity compared to a monolithic substrate design.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces the communication distance and footprint of wiring, enhancing the reliability of the electronic circuit assembly by utilizing a substrate with low CTE that minimizes deformation with temperature changes, allowing for efficient side packaging and improved performance in electronic products.

Implementation Method 1

The interposer substrate with a first coefficient of thermal expansion (CTE) includes a first surface, a second surface opposite to the first surface, and a first side surface connecting to the first surface and the second surface. The wiring substrate with a second CTE is disposed below the second surface. The first CTE is lower than the second CTE.

Methodology Applied

Scientific EffectCoefficient of thermal expansion (CTE): Thermal Expansion

Data Source

PatentUS11792922B2Electronic circuit assembly and method for manufacturing thereof

Publication Date: 2023.10.17 UNIMICRON TECH CORP

AI summary

An electronic circuit assembly includes an interposer substrate, a wiring substrate, an electrical connective part and an electronic component. The interposer substrate with a first coefficient of thermal expansion (CTE) includes a first surface, a second surface opposite to the first surface, and a first side surface connecting to the first surface and the second surface. The wiring substrate with a second CTE is disposed below the second surface. The first CTE is lower than the second CTE. The electrical connective part is disposed in the interposer substrate and extends to the first side surface. The electronic component is attached to the first side surface and is electrically connected to the electrical connective part.