Side-Mounted Optoelectronic Transducer Interconnects
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Solution Overview
Problem
Optoelectronic interconnects in high data rate, high bandwidth communication systems require precise alignment processes for directing light between optical fibers and optoelectronic transducers, leading to complex and costly configurations.
Innovation Solution
A method involving the fabrication of semiconductor dies with conductive vias that form contact pads upon dicing, allowing direct attachment of optoelectronic transducers to ancillary circuitry, and the use of an L-shaped fixture for reduced interconnect length and simplified optical and mechanical configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional hybrid assembly techniques are used for fabricating optoelectronic interconnects, then the integration of control chip with optoelectronic transducers is achieved, but the alignment process becomes complex and costly
Solution Approach 1:
The invention segments the interconnect structure by separating the control chip and optoelectronic transducer into distinct semiconductor dies that are diced from separate wafers. The control chip die includes conductive vias that form contact pads on its side face, while the optoelectronic transducer die is mounted directly onto these contact pads, eliminating the need for complex alignment processes in traditional hybrid assembly
Solution Approach 2:
The invention transitions from planar alignment to three-dimensional stacking by mounting the optoelectronic transducer die vertically onto the side face of the control chip die. This dimensional change allows for simplified alignment since the contact pads are formed on the vertical side face rather than requiring precise lateral alignment on a planar surface
2Reliability
If conventional interconnect structures are used, then the connection between optical fiber core and optoelectronic transducer is established, but the interconnect length remains long
Solution Approach 1:
The invention embeds the optoelectronic transducer die directly onto the contact pads of the control chip die, creating a nested structure where the transducer is positioned immediately adjacent to the control circuitry. This nesting eliminates intermediate connection elements and reduces the interconnect length to the minimum necessary distance
Solution Approach 2:
The conductive vias that form contact pads on the side face of the control chip die serve as direct intermediary connection elements. These vias provide immediate electrical connection between the control circuitry and the optoelectronic transducer, eliminating the need for long trace interconnects or additional bonding layers
3Measurement precision
If precision alignment processes are implemented, then light direction between optical fiber and transducer is achieved, but the manufacturing cost increases
Solution Approach 1:
The conductive vias are formed and configured during the wafer fabrication process before dicing, so that the contact pads are pre-positioned on the side face of the control chip die. This preliminary action eliminates the need for costly post-dicing alignment processes, as the alignment features are already built into the structure during standard semiconductor manufacturing
Solution Approach 2:
The side-mounted contact pads on the control chip die serve as self-aligning features for the optoelectronic transducer die. The transducer die is mounted directly onto these contact pads, which automatically provide both electrical connection and positional alignment, eliminating the need for separate alignment procedures
Data Source
AI summary
A method for fabricating an optical interconnect includes producing a semiconductor wafer that includes multiple first dies. Each first die includes circuitry disposed over a surface of the wafer and connected to conductive vias arranged in rows. The multiple first dies are diced by cutting the wafer across the rows of the vias, such that, in each first die, the cut vias form respective contact pads on a side face of the first die that is perpendicular to the surface. A second semiconductor die including one or more optoelectronic transducers is attached to the contact pads, so as to connect the transducers to the circuitry.