Side-Mounted PCB Connection for Display Panel

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Solution Overview

Problem

Display panels face challenges in structural integrity and compact configuration due to the extension of printed circuit boards (PCBs) parallel to the panel, which increases the non-display area and can damage signal lines during manufacturing processes like grinding.

Innovation Solution

The PCB is connected to the side surface of the display panel, with an insulating structure and signal line configuration that aligns with the panel's side surface, using organic and inorganic layers to secure the signal line and prevent damage, and a connection pad for secure electrical connection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If the PCB is connected parallel to the display panel, then the electrical connection is established, but the non-display area increases and structural integrity deteriorates

Engineering Contradiction:
Improvenon-display areaVSAvoidstructural integrity
Core Design Contradiction:
Area of stationary objectVSStability of the object's composition

Solution Approach 1:

The patent transitions the PCB connection from a planar configuration (parallel to the display panel) to a three-dimensional configuration (perpendicular to the display panel). The PCB is bent at a predetermined angle to connect to the side surface of the display panel, utilizing the thickness direction as an additional dimension. This dimensional change reduces the non-display area while improving structural integrity by creating a more compact and stable assembly.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If the PCB is connected parallel to the display panel, then the electrical connection is established, but the overall dimensions increase

Engineering Contradiction:
Improvecompact configurationVSAvoidoverall dimensions
Core Design Contradiction:
Ease of operationVSLength of stationary object

Solution Approach 1:

The patent utilizes the thickness direction of the display panel as an additional dimension for PCB connection. By bending the PCB and connecting it to the side surface, the overall length and width of the display device are reduced, achieving a more compact configuration. The PCB extends in the thickness direction rather than parallel to the display panel surface, optimizing the spatial arrangement.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If the signal line is exposed during manufacturing, then the electrical connection is accessible, but the signal line is damaged or deformed

Engineering Contradiction:
Improvesignal line protectionVSAvoidelectrical connection accessibility
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent incorporates support structures (such as insulating layers or protective layers) during the manufacturing process to prevent signal line damage before the actual electrical connection is made. These support structures are preliminarily positioned to protect the signal line from deformation or damage during subsequent manufacturing steps like grinding or dicing, ensuring signal line integrity while maintaining manufacturing accessibility.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11686981B2Display panel
Publication Date: 2023.06.27 SAMSUNG DISPLAY CO LTD
  • US11686981B2 patent drawing
  • US11686981B2 patent drawing
  • US11686981B2 patent drawing

AI summary

A display panel includes: a first substrate having a top surface and a side surface, the top surface including a display area and a non-display area outside the display area; a second substrate facing the first substrate; a first insulating structure disposed between the second substrate and the first substrate, wherein the first insulating structure overlaps the non-display area without overlapping the display area; an organic light emitting diode between the first substrate and the second substrate and overlapping the display area; a thin film encapsulation layer on the organic light emitting diode; a signal line having a side surface substantially aligned with the side surface of the first substrate, wherein the signal line is disposed on the first substrate; a second insulating structure overlapping the signal line and disposed between the first substrate and the first insulating structure, wherein the second insulating structure has a side surface substantially aligned with the side surface of the first substrate; and a connection pad being in contact with the side surface of the signal line, wherein the second insulating structure includes an organic layer overlapping the signal line and the non-display area without overlapping the display area.