Side-Outlet Speaker Assembly for High-Frequency Phone Audio
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Solution Overview
Problem
Lateral sound-emitting designs in portable electronic devices suffer from high-frequency attenuation and acoustic performance degradation due to blocked sound outlets and narrow acoustic channels, which are exacerbated by user interference.
Innovation Solution
The electronic device incorporates a magnetic conductive member, such as a yoke, directly fixed to the housing plate portion, which serves as a sound-emitting component, improving high-frequency response and reducing user interference by allowing the sound outlet to be on the side surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If lateral sound-emitting design is adopted to maximize display screen area, then screen-to-body ratio is improved, but high-frequency attenuation occurs due to blocked sound outlet and narrow acoustic channel
Solution Approach 1:
The patent transitions from traditional front-facing sound emission to lateral sound emission by positioning the sound outlet on the side surface of the device. This dimensional change allows the acoustic channel to extend along the side edge rather than through the front, bypassing the display screen obstruction and improving high-frequency response while maintaining the narrow bezel design.
2Area of stationary object
If lateral sound outlet is positioned on side surface, then display screen area is maximized, but sound outlet is easily blocked by user's finger during device holding
Solution Approach 1:
The patent divides the sound emission function across multiple locations by incorporating both lateral sound outlets on the side surface and additional sound outlets on the bottom surface. This segmentation ensures that even if one outlet is blocked, sound can still emanate from other outlets, maintaining acoustic performance during device operation.
3Reliability
If magnetic conductive member is directly fixed to housing plate portion, then high-frequency sound quality is enhanced, but device complexity increases
Solution Approach 1:
The patent integrates the magnetic conductive member directly into the housing plate portion, merging the speaker assembly with the device chassis. This integration eliminates the need for separate mounting structures and intermediate components, reducing overall device complexity while maintaining the enhanced high-frequency sound quality provided by the direct magnetic coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances high-frequency sound quality and maintains acoustic performance by preventing sound outlet blocking, even when the device is held, through a direct connection of the magnetic conductive member to the housing plate.
Implementation Method 1
a magnetic conductive assembly being configured to guide and concentrate magnetic flux from the magnet through the magnetic gap
Implementation Method 2
a vibration assembly comprising a diaphragm and a voice coil connected to the diaphragm, with at least a portion of the voice coil being suspended within the magnetic gap
Data Source
Figure 1
Figure 2~3A
Figure 3B~4A
AI summary
An electronic device is disclosed, comprising: an electronic device housing having a housing plate portion; at least one speaker arranged in the electronic device housing, the speaker comprising: a magnetic circuit assembly defining a magnetic gap and comprising a magnet and a magnetic conductive assembly, the magnetic conductive assembly being configured to guide and concentrate magnetic flux from the magnet through the magnetic gap, the magnetic conductive assembly comprising a first magnetic conductive member constituting at least a portion of bottom of the magnetic circuit assembly, and a vibration assembly comprising a diaphragm and a voice coil connected to the diaphragm, with at least a portion of the voice coil being suspended within the magnetic gap, wherein the first magnetic conductive member of the magnetic circuit assembly is directly fixedly connected to the housing plate portion of the electronic device housing.