Side Retainer Assembly for Memory Module Heat Sink
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Solution Overview
Problem
Existing heat sink technologies for memory modules are inefficient in heat dissipation and mechanical stability, particularly for modules installed horizontally on printed circuit boards, where the bottom surface is confined, trapping heat and lacking adequate attachment assemblies to secure the heat sinks and memory modules firmly.
Innovation Solution
A side retainer assembly with a clip and retainer system that includes a clip base attached to a socket connector, with clip and retainer members extending to form an opening and hooks for secure attachment to the printed circuit board, providing efficient heat dissipation and mechanical stability by covering both top and bottom surfaces of the memory module with a C-shaped heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is provided separately on both sides of the memory module, then thermal management is improved, but the bottom surface heat is trapped in confined space causing reduced heat dissipation efficiency
Solution Approach 1:
The heat sink extends laterally beyond the memory module boundaries to access additional thermal management space in the horizontal dimension. This allows the bottom surface heat dissipation to access open space rather than being confined vertically, effectively using another spatial dimension to resolve the heat trapping problem
2Stability of the object's composition
If adequate attachment assemblies are added to secure heat sinks and memory modules firmly, then mechanical stability is improved, but device complexity increases
Solution Approach 1:
The attachment assembly merges the heat sink structure with the memory module retention function. The clips and retainers that provide mechanical stability are integrated directly into the heat sink body, eliminating separate attachment components and reducing overall device complexity while maintaining firm securing of the memory module
Solution Approach 2:
The heat sink structure performs multiple functions simultaneously: thermal management and mechanical retention of the memory module. The clips and retainers are designed to both secure the module firmly and form part of the heat dissipation structure, providing universal functionality that improves stability without adding dedicated attachment complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal management by ensuring efficient heat transfer from both sides of the memory module and provides improved mechanical stability without occupying additional space on the printed circuit board, reducing the risk of component failure due to heat buildup.
Implementation Method 1
The solution enhances thermal management by ensuring efficient heat transfer from both sides of the memory module
Data Source
AI summary
A side clip has a clip base attached to a socket connector and a first clip member and a second clip member extending from the clip base. The first clip member has a terminal for attaching to a printed circuit board. The second clip member is spaced in parallel from the first member and connected to the first clip member by a distal segment to form an opening. A side retainer has a retainer base having first and second ends and first, second, third, and fourth retainer members extending vertically from the retainer base. The first retainer member fits a hole on a board held by the side clip. The second retainer member is located at the first end and has an inward hook. The fourth retainer member is located on the second end and has an outward hook.