Side Substrate Wiring via Sputtering for Bezel-less Displays
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Solution Overview
Problem
Conventional methods for forming wiring on substrates, such as silk printing, result in non-uniform electric characteristics due to high resistance and material uniformity issues, and lack effective techniques for forming low-resistance wiring on the side portions of substrates, which is essential for bezel-less large-screen and high-definition displays.
Innovation Solution
A method involving sputtering is used to form wiring on the side portions of substrates, utilizing a deposition mask and a central source target with side source targets to achieve low resistance and improved electric characteristics, enabling electrical connection between top and bottom circuit patterns and allowing for bezel removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If silk printing technique is used to form wiring on substrate, then wiring can be formed on substrate surface, but wiring resistance is high and electric characteristics are non-uniform
Solution Approach 1:
The patent replaces the silk printing technique (mechanical/wet process) with a sputtering process (physical vapor deposition). This substitution eliminates the material uniformity issues and high resistance inherent in silk printing, achieving low-resistance wiring with uniform electric characteristics through controlled physical deposition of conductive material.
Solution Approach 2:
The patent changes the deposition method parameter from wet printing to vacuum sputtering. This parameter change transforms the wiring formation process, enabling precise control over material deposition and achieving uniform thickness and composition, which directly improves wiring resistance and electric characteristic uniformity.
2Area of stationary object
If wiring is formed on lateral side of substrate to achieve bezel-less display, then active area increases, but no concrete method is provided for forming low-resistance wiring on side portion
Solution Approach 1:
The patent extends wiring formation from the traditional planar substrate surface to the lateral side surface, utilizing the third dimension (vertical/depth direction). By forming wiring on the side portion through sputtering, the patent enables bezel-less display design with improved active area while maintaining low resistance through the same physical vapor deposition process used for top/bottom wiring.
Solution Approach 2:
The patent applies the same sputtering process universally to both the top surface and side portions of the substrate. This multi-functional application of the deposition technique ensures consistent material properties and electric characteristics across different substrate regions, enabling reliable wiring formation for bezel-less display configurations.
3Ease of manufacture
If wet process is used for wiring formation, then wiring can be applied on substrate, but contamination with impurities affects physical electric characteristics
Solution Approach 1:
The patent substitutes the wet process (chemical/solution-based) with a sputtering process (physical vapor deposition in vacuum). This replacement eliminates contamination from solvents, adhesives, and environmental impurities that plague wet processes, while maintaining ease of manufacture through a standardized deposition technique. The resulting wiring exhibits superior physical electric characteristics due to the clean, controlled deposition environment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively forms wiring with low resistance and improved electric characteristics, enabling the electrical connection of top and bottom circuit patterns, thus facilitating the creation of large-screen and high-definition display apparatuses by removing the bezel.
Implementation Method 1
forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber
Data Source
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AI summary
The disclosure relates to a method of forming wiring on a substrate, and more particularly to a method of forming wiring on a side portion of a substrate, in which sputtering is used to form the wiring on the side portion of the substrate, thereby forming the wiring with low resistance and thus providing the substrate improved in electric characteristics. As the method of forming wiring on a side portion of a substrate according to the disclosure, a method of forming wiring of a substrate includes masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; and forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber.