Side-Surface Conductive Interconnect for Lower Contact Resistance
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Solution Overview
Problem
Existing electronic devices face challenges in ensuring efficient electric transmission between surfaces of varying dimensions due to high contact resistance, particularly in areas with small contact areas between conductive elements.
Innovation Solution
The electronic device incorporates an auxiliary bonding pad and a second wire, both made from the same conductive material, with a larger contact area than the traditional contact area, reducing contact resistance by increasing the contact area and modifying the metallic bond between the second wire and the auxiliary bonding pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a traditional contact configuration is used between conductive elements on different surfaces, then the device structure remains simple, but the contact area is small resulting in high contact resistance
Solution Approach 1:
The patent extends the contact interface from a single-point or small-area contact to a multi-dimensional contact path. The third conductive element creates a distributed contact network that spans across surfaces, transforming a one-dimensional contact point into a two-dimensional contact area, thereby reducing contact resistance without significantly increasing structural complexity
Solution Approach 2:
The third conductive element acts as an intermediary that bridges the first and second conductive elements. This intermediate element creates additional contact pathways and increases the overall contact area between conductive elements on different surfaces, effectively reducing contact resistance while maintaining a relatively simple device structure
2Reliability
If the contact area between conductive elements is increased, then contact resistance is reduced, but the device structure becomes more complex
Solution Approach 1:
The patent merges multiple conductive elements (first, second, and third conductive elements) into a unified contact system. By combining these elements to work together, the total contact area is increased and contact resistance is reduced, while the combined structure remains more simple than implementing separate complex contact mechanisms for each interface
Solution Approach 2:
The contact system is segmented into multiple discrete conductive elements that can be independently optimized and positioned. This segmentation allows the contact area to be distributed across multiple locations, reducing contact resistance through increased total contact area while keeping each individual element relatively simple in structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the contact between side wiring and the first wire, ensuring effective electric transmission and reducing contact resistance, thereby improving the efficiency of electric transmission between surfaces.
Implementation Method 1
The third conductive element contacts the first conductive element to define a first contact area, the third conductive element contacts the second conductive element to define a second contact area
Data Source
AI summary
An electronic device includes a first substrate, a second substrate, a first conductive element, a second conductive element and a third conductive element. The first substrate has a top surface and a first side surface. The second substrate is oppositely disposed on the first substrate and has a second side surface parallel to the first side surface. The first conductive element and the third conductive element are disposed on the top surface of the first substrate. The second conductive element is disposed on the first side surface of the first substrate and the second side surface of the second substrate. The third conductive element contacts the first conductive element to define a first contact area, the third conductive element contacts the second conductive element to define a second contact area, and the first contact area is greater than the second contact area.