Side-Surface Conductive Patterns for Seamless Tiled Displays
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Solution Overview
Problem
Existing large-scale electronic devices with tiled panels face challenges in achieving seamless tiling due to the need for space to bend soft panels, which results in visible gaps between panels.
Innovation Solution
Adjusting the electrical resistance of conductive patterns corresponding to different signal lines by varying their widths, materials, thicknesses, or numbers to facilitate seamless tiling displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If soft panels are bent to reduce gaps between tiling panels, then the visibility of gaps is reduced, but space is required for the bending process which prevents true seamless tiling
Solution Approach 1:
The patent replaces the mechanical bending system with an electrical signal transmission system. Instead of physically bending soft panels to bridge gaps, the invention uses conductive patterns on rigid substrates to transmit signals across panel boundaries, eliminating the need for mechanical deformation and the space it requires.
Solution Approach 2:
The patent transitions from a two-dimensional flexible panel bending approach to a multi-dimensional rigid substrate configuration with conductive patterns that extend across panel interfaces. The conductive patterns are disposed on side surfaces and connect to signal lines, creating a three-dimensional electrical connection pathway that eliminates gap visibility without requiring panel bending space.
2Reliability
If conductive patterns with different electrical resistances are used for different signal lines, then signal transmission efficiency is improved, but device complexity increases due to multiple conductive patterns with varying properties
Solution Approach 1:
The patent applies local quality by assigning different electrical resistance values to different conductive patterns based on their specific signal transmission requirements. Each conductive pattern's resistance is optimized for its particular signal line, with higher resistance for low-voltage signals and lower resistance for high-voltage signals, improving overall system reliability.
Solution Approach 2:
The patent utilizes parameter changes by varying the electrical resistance of conductive patterns through adjustments in material composition, geometry (width and length), and layer structure. This allows the same conductive pattern layer to serve multiple signal lines with different electrical requirements, managing complexity through controlled parameter variation rather than completely separate structures.
Data Source
AI summary
An electronic device includes a substrate; a first signal line and a second signal line disposed on the top surface; a first conductive pattern having a first total width corresponding to a first signal voltage, disposed on the first side surface and electrically connected to the first signal line; and a second conductive pattern having a second total width corresponding to a second signal voltage, disposed on the second side surface and electrically connected to the second signal line, the second signal voltage higher than the first signal voltage so that the second total width is greater than the first total width; and a protection element at least partially overlapping at least one of the first conductive pattern and the second conductive pattern, at least one of the first conductive pattern and the second conductive pattern including at least one dummy sub-pattern and at least one sub-pattern.