Side-Surface Driver Layout for Narrow-Bezel Display Panels
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Solution Overview
Problem
Conventional display devices have a large bezel area due to the placement of gate drivers and data drivers, which hinders the minimization of the overall display device size.
Innovation Solution
The implementation of recessed conductive layers on the side surfaces of the display device substrates allows for the connection of gate and data drivers, minimizing the area required for these components and reducing the bezel size by integrating them into the substrate structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If gate drivers and data drivers are disposed in the bezel area, then the drivers can be connected to the display panel, but the bezel area becomes large
Solution Approach 1:
The patent moves the gate driver and data driver from the traditional planar bezel area to the side surface of the display panel, utilizing a different spatial dimension. This dimensional transition allows the drivers to be positioned vertically on the side surface rather than horizontally in the bezel, effectively reducing the bezel area while maintaining driver functionality through conductive layer connections.
Solution Approach 2:
The gate driver and data driver are integrated into recessed portions of the side surface, creating a nested structure where the drivers are embedded within the substrate rather than occupying external space. This nesting approach allows the drivers to be housed within the existing substrate structure, minimizing the overall device footprint and reducing bezel requirements.
2Area of stationary object
If drivers are integrated into the substrate structure, then the bezel area is minimized, but the manufacturing process becomes more complex
Solution Approach 1:
The side surface is divided into recessed portions that separately accommodate the gate driver and data driver, allowing each driver to be independently positioned and connected. This segmentation enables modular manufacturing where conductive layers can be separately formed and connected to each driver, simplifying the integration process despite the three-dimensional configuration.
Solution Approach 2:
The recessed portions are pre-formed in the substrate before the drivers are positioned and connected. This preliminary structuring of the substrate creates ready-made mounting locations and connection pathways, facilitating subsequent driver integration and reducing the complexity of the overall manufacturing process.
Data Source
AI summary
A display device includes a first substrate, a second substrate disposed on the first substrate, an image display layer disposed between the first substrate and the second substrate, a gate driver disposed at a first side surface of the first substrate, a data driver disposed at a second side surface of the first substrate, and conductive layers respectively disposed in recesses recessed from the first side surface of the first substrate. The gate driver is electrically connected to the conductive layers.