Side-to-Side Airflow Control for Electronic Enclosures

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current side-to-side airflow management systems for electronic equipment enclosures are inadequate, particularly when exhaust ducts are located at the top, as they do not provide a versatile and adjustable solution for routing heated air effectively, leading to potential re-circulation of heat within the enclosure.

Innovation Solution

A side-to-side airflow control system that includes a manifold with angled walls and adjustable filler panels to redirect heated air from the equipment through a top opening into an exhaust duct, preventing mixing with cooling air and allowing for flexible sizing to accommodate different equipment configurations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If individual exhaust ducts are designed and sized to fit particular switch types, then exhaust air can be effectively routed outside the enclosure, but device complexity increases and adaptability decreases when equipment configurations vary

Engineering Contradiction:

Improveexhaust air routing effectivenessVSAvoidaccommodation of different equipment configurations

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The patent implements a universal exhaust duct design with adjustable filler panels that can accommodate different switch sizes and configurations. Instead of designing separate ducts for each switch type, a single duct structure with adjustable components serves multiple equipment variations, enabling one duct to universally handle various exhaust scenarios while maintaining effective heat removal

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The exhaust duct incorporates adjustable filler panels that can be dynamically reconfigured based on the specific equipment installation. These adjustable components allow the duct system to adapt its internal geometry and airflow characteristics to match different switch sizes and positions, providing dynamic adaptability without requiring complete redesign for each equipment variation

Inventive Principle:

Principle #15Dynamics

2Ease of operation

If adjustable filler panels are used to control airflow above and below side inlets and outlets, then airflow control is improved, but the solution does not work well with exhaust ducts located at the top of the enclosure

Engineering Contradiction:

Improveairflow controlVSAvoidcompatibility with top-mounted exhaust ducts

Core Design Contradiction:

Ease of operationVSAdaptability or versatility

Solution Approach 1:

The patent extends the adjustable filler panel concept from horizontal airflow control (above and below inlets) to vertical airflow control (at the top exhaust opening). By adding adjustability in the vertical dimension at the exhaust end, the system can now effectively control airflow paths for top-mounted exhaust ducts, complementing the existing side airflow control capabilities

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If exhaust ducts are located at the top of the enclosure, then heat can be exhausted away from equipment, but existing airflow control systems cannot effectively route heated air through the top opening

Engineering Contradiction:

Improveheat exhaustionVSAvoidheated air routing

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The exhaust duct is segmented into adjustable sections with filler panels that can be independently configured. This segmentation allows the system to control airflow at different levels and angles, enabling effective routing of heated air upward through the top opening while maintaining adaptability to different equipment heat generation patterns and enclosure configurations

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively routes heated air from electronic equipment through a top opening and into an exhaust duct, preventing re-circulation and ensuring efficient heat management, even with varying equipment sizes and configurations.

Implementation Method 1

A side-to-side airflow control system that includes a manifold with angled walls and adjustable filler panels to redirect heated air from the equipment through a top opening into an exhaust duct

Methodology Applied

Scientific EffectFlow redirection through angled surfaces:

Implementation Method 2

preventing mixing with cooling air

Methodology Applied

Scientific EffectPhysical barrier separation:

Data Source

PatentUS7957139B2Electronic equipment enclosure with side-to-side airflow control system

Publication Date: 2011.06.07 CHATSWORTH PRODUCTS INC

AI summary

An electronic equipment enclosure system with a side-to-side airflow control system includes an enclosure, having a front, a rear, a top, a bottom and two sides, and a side-to-side airflow control system. The airflow control system includes a side wall disposed adjacent one side of the enclosure, and a manifold disposed adjacent the other side of the enclosure. Electronic equipment having a front, a rear, a top, a bottom and two sides is disposed between the side wall and the manifold. Cooling air is routed into a first of the two sides of the electronic equipment, and heated exhaust air is routed out of a second side of the two sides of the electronic equipment and into the manifold. The side wall prevents the heated exhaust air from mixing with the cooling air at the first side of the electronic equipment.