Display Panel Side-Trace Alignment for Narrow Bezels
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Solution Overview
Problem
The manufacturing process of narrow-bezel display panels is hindered by laser film cutting equipment errors, which cause increased bezel size and residual adhesive issues, affecting circuit characteristics.
Innovation Solution
A display panel design incorporating a side boundary definition layer on the array substrate, with connecting traces and conductive layers, and an encapsulation layer to ensure precise alignment and protection, using photolithography or printing processes to minimize bezel width and prevent corrosion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If laser film cutting equipment is used to manufacture narrow-bezel display panels, then the bezel width can be reduced, but manufacturing errors increase causing increased bezel size and residual adhesive issues
Solution Approach 1:
A boundary definition layer is introduced as an intermediary element between the array substrate and the connecting trace. This layer serves as a reference standard for alignment, allowing the connecting trace to be precisely positioned relative to the array substrate edge. The boundary definition layer includes a boundary definition trace that extends from the array substrate edge outward, providing a clear visual and physical guide for subsequent manufacturing steps, thereby eliminating the precision errors associated with direct laser cutting.
Solution Approach 2:
The boundary definition layer is formed in advance before the connecting trace is created. By pre-establishing the boundary definition trace and related structures, the subsequent formation of the connecting trace can reference this pre-defined boundary, ensuring precise alignment without relying on error-prone laser cutting operations. This preliminary action sets up a reference framework that guides the entire subsequent manufacturing process.
2Length of stationary object
If laser film cutting is used to reduce bezel width, then narrow bezel is achieved, but residual adhesive remains affecting circuit characteristics
Solution Approach 1:
The harmful residual adhesive is extracted and removed from the system. The manufacturing process specifically includes steps to remove adhesive residue from the array substrate edge and boundary definition layer. By extracting this harmful element, the circuit characteristics are protected from degradation, while still maintaining the narrow bezel design through the boundary definition layer approach.
3Length of stationary object
If connecting trace is formed on the side surface of array substrate, then narrow bezel is achieved, but the trace is exposed and susceptible to corrosion
Solution Approach 1:
Protective structures are built in advance to cushion and protect the connecting trace from corrosion. The boundary definition layer and its protective coating are formed before the connecting trace is created, providing a pre-established protective framework. Additionally, the connecting trace is designed to be covered by subsequent encapsulation layers, creating multiple layers of protection against environmental corrosion while maintaining the narrow bezel configuration.
Solution Approach 2:
Thin film encapsulation layers are used to cover and protect the connecting trace. These flexible protective films conform to the three-dimensional structure of the connecting trace on the array substrate side surface, providing effective corrosion protection while maintaining the compact narrow bezel design. The thin film approach allows protection without adding significant bulk or interfering with the narrow bezel geometry.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables narrow bezel formation by reducing manufacturing errors and preventing adhesive residue, while maintaining circuit integrity and reducing the risk of corrosion.
Implementation Method 1
using photolithography or printing processes to minimize bezel width and prevent corrosion
Implementation Method 2
the connecting trace is etchable by a chemical solution with a first acidity
Implementation Method 3
the first conductive layer and/or the second conductive layer is etchable by a chemical solution with a second acidity
Implementation Method 4
an encapsulation layer, located on an edge of the array substrate and covering the side boundary definition layer and the connecting traces
Data Source
AI summary
A display panel and a method for manufacturing the same, and a tiled screen device. The display panel includes an array substrate, comprising a first surface, a second surface, and a first side surface connecting the first surface and the second surface, the first surface and the second surface being opposite to each other; a first pad, located on the first surface; a second pad, located on the second surface; a connecting trace, connecting the first pad and the second pad, the connecting trace is at least partially located on the first side surface; and a side boundary definition layer, located on an edge of the array substrate and located on a side of the connecting trace away from the array substrate. The display panel, the method for manufacturing the same, and the tiled screen device facilitate achieving narrow bezel.