Side-Type LED Package With Multilayer Lead-Frame Heat Dissipation
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Solution Overview
Problem
The challenge of thinning the side type light emitting diode package in display devices leads to a narrower space between the light emitting diode chip and the reflector, necessitating improved heat dissipation designs to manage temperature rise.
Innovation Solution
A light emitting diode with a lead frame unit comprising multiple conductive layers on different layers, including an upper, intermediate, and lower conductive layers, and a dummy terminal structure for enhanced heat dissipation, connected through via holes and solder paste to facilitate heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the side type light emitting diode package is reduced, then the display device thickness is reduced, but the space between the light emitting diode chip and reflector becomes narrow, making heat dissipation difficult
Solution Approach 1:
The patent transitions from a conventional single-layer lead frame structure to a multi-layer lead frame structure with upper, intermediate, and lower conductive layers arranged in different dimensions. This dimensional change allows heat dissipation pathways to be established in multiple layers simultaneously, effectively managing heat in the thinned package without requiring increased vertical space.
Solution Approach 2:
The lead frame is segmented into multiple independent conductive layers (upper, intermediate, lower) that can be positioned at different heights and locations. This segmentation allows heat to be dissipated through multiple distributed pathways rather than relying on a single heat dissipation route, solving the heat management problem in thin packages.
2Temperature
If a multi-layer conductive structure is added for heat dissipation, then heat dissipation performance is improved, but the device complexity increases
Solution Approach 1:
The multi-layer conductive structure serves multiple functions simultaneously: it provides electrical connection between the light emitting diode chip and external circuits, and it acts as a heat dissipation pathway. By making the lead frame structure multi-functional, the patent avoids adding separate dedicated heat dissipation components that would further increase complexity.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single integrated multi-layer lead frame structure. The same conductive layers that provide electrical pathways also serve as thermal pathways, combining multiple functions into one structure rather than adding separate components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design provides improved heat dissipation performance by dispersing heat through multiple conductive layers and a dummy terminal, ensuring effective thermal management in thin light emitting diode packages.
Implementation Method 1
an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another
Implementation Method 2
the second insulating substrate is partially removed to have a dummy solder hole, and the intermediate dummy layer and the lower dummy layer are electrically connected to each other through a solder paste disposed in the dummy solder hole
Data Source
AI summary
A light emitting diode having an improved heat dissipation effect includes a light source unit emitting a light to a front surface and including a light emitting part, a first electrode pad, and a second electrode pad. The light emitting diode further includes a lead frame unit disposed on a rear surface of the light source unit and including first and second lead terminals respectively connected to the first and second electrode pads. The light emitting diode also includes at least one of the first and second lead terminals includes an upper conductive layer, an intermediate conductive layer, and a lower conductive layer which are disposed on different layers and electrically connected to one another.