Side-Via LED Driver Packaging for Micro-LED Assembly Yield
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Solution Overview
Problem
Existing technologies face challenges in efficiently manufacturing micro-LED display products due to the small chip sizes of micro-LEDs and micro-LED pixel driver circuits, which limits productivity and leads to yield loss, quality, and reliability issues.
Innovation Solution
The development of a Light-Emitting Diode (LED) driving device that utilizes a side Through Silicon Via (TSV) for 3D micro-LEDs and micropixel driving circuits, allowing for the formation of a silicon side via to secure mounting areas and form wiring, thereby improving assembly efficiency and simplifying the fabrication process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If existing wafer processing packaging method is applied to micro-LED and micro-LED pixel driver circuit, then productivity is improved, but yield loss and quality/reliability problems occur due to extremely small chip sizes
Solution Approach 1:
The patent transitions from planar (2D) chip mounting to three-dimensional (3D) stacking architecture. Multiple chip layers (micro-LED chip, driver circuit chip, package substrate) are vertically stacked and interconnected through conductive vias, enabling high-density integration while maintaining manufacturability through standardized wafer-level processing.
Solution Approach 2:
The patent implements a nested structure where the micro-LED chip is mounted on the package substrate, the driver circuit chip is mounted on the package substrate adjacent to the micro-LED chip, and both are interconnected through conductive vias penetrating the package substrate. This nested arrangement allows compact integration of multiple functional components.
2Manufacturing precision
If chip mounting or pick & place is applied to mount pixel circuit for high resolution, then mounting precision is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent performs preliminary alignment and bonding of the micro-LED chip and driver circuit chip to the package substrate in a wafer-level process before final assembly. This preliminary action ensures precise positioning and electrical connections are established early in the manufacturing process, eliminating the need for complex post-bonding alignment operations.
Solution Approach 2:
The package substrate serves multiple functions: it provides mechanical support for mounting both the micro-LED chip and driver circuit chip, establishes electrical connections through conductive vias, and enables signal routing between different chip layers. This multi-functional design simplifies the overall manufacturing process.
3Productivity
If mass production process is applied to micro-LED, then productivity is improved, but yield loss increases due to small chip sizes
Solution Approach 1:
The patent divides the manufacturing process into discrete wafer-level stages: wafer fabrication, wafer bonding, dicing, and final assembly. Each stage processes multiple chips simultaneously, maximizing productivity while minimizing handling-induced defects and yield loss associated with individual chip manipulation.
Data Source
AI summary
Disclosed are an LED driving device, a method of fabricating the LED driving device and a display device including the LED driving device. The LED driving device includes a drive circuit part for driving an LED; an input/output pad for input/output of a driving-related signal of the LED, the input/output pad being connected to the drive circuit part; a wiring part formed based on a metal deposited or plated through a via formed in scribe lanes positioned on at least one side surface of the drive circuit part and configured to connect an attachment part for attachment to the drive circuit part, the input/output pad and a main board; and an insulating film configured to insulate a peripheral region of the drive circuit part except for a region in which the drive circuit part and the input/output pad are connected to the wiring part.