Side-Via RF Module Layout for Impedance Matching and Low Signal Loss
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Solution Overview
Problem
The challenge is to minimize signal loss and improve mass productivity while optimizing RF matching and reducing bur and plating defects in surface mounted device modules, particularly by designing side vias and RF patterns to accommodate substrates with varying diameters and positioning the via hole center in the outer periphery during manufacturing.
Innovation Solution
The solution involves forming side vias with different horizontal and vertical diameters, positioning the via hole center in the outer periphery, and configuring the RF pattern with specific distance settings for impedance matching, using a formula that considers substrate thickness, permittivity, and via pad dimensions to optimize electrical connections and reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If via holes are formed in the outer periphery of PCB substrate and routing process is performed, then PCB substrate is cut to product size, but bur phenomenon and plating defects occur on the surface of via holes
Solution Approach 1:
The via holes are pre-formed at the outer periphery of the PCB substrate before the routing process. By positioning the via holes strategically and forming them in advance, the subsequent routing operation can proceed without causing bur phenomenon or plating defects on the via hole surfaces, as the via holes are already properly plated and positioned to avoid damage during cutting.
2Ease of manufacture
If conventional via holes with same inner diameter are used, then manufacturing is simple, but signal loss occurs when different substrates are bonded
Solution Approach 1:
The invention employs via holes with different inner diameters at different positions, particularly at the bonding interfaces between substrates. By using asymmetric via hole designs with larger diameters at bonding surfaces, the electrical connection area is increased, thereby reducing signal loss during substrate bonding while maintaining manufacturability through a systematic hole formation process.
3Reliability
If side via is exposed to outer periphery in various shapes, then RF matching is optimized, but device complexity increases
Solution Approach 1:
The side via is designed with different shapes at different locations - specifically, the via hole has different horizontal and vertical diameters to create an elliptical or rectangular cross-section. This local variation in geometry optimizes RF matching characteristics at the via interface while maintaining a relatively simple overall structure that can be manufactured using standard PCB processes.
Data Source
AI summary
A surface mounting component module according to one embodiment of the present invention comprises: a multi-layer substrate; a side via formed by penetrating the multi-layer substrate, and electrically connecting the multi-layer substrate; a side via pad positioned on at least one layer of the multi-layer substrate, and formed in the vicinity of the side via; and an RF pattern connected to the side via pad by a signal line, wherein all of the RF pattern, the side via, and the side via pad are electrically connected.