Side-View LED Module Layout for Uniform Edge Backlighting
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Solution Overview
Problem
Side-view type light emitting devices used in edge type backlight modules face challenges in maintaining high luminous efficacy while preventing dark spots and maintaining a small size, as they require precise light distribution and alignment to avoid gaps between adjacent devices.
Innovation Solution
The proposed light emitting device includes a light emitting diode chip with bump pads, a light transmitting member, a white barrier member, and an electrically conductive bonding member, where the white barrier member covers opposite long side surfaces and the light transmitting member has a rectangular shape with long and short sides, allowing for efficient light distribution and alignment of adjacent devices to minimize dark spots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the side-view type light emitting device is made elongated to emit light broadly along the edge of the light guide plate, then the light distribution is improved, but the device size increases and alignment precision between adjacent devices becomes more difficult to maintain
Solution Approach 1:
The light emitting device is segmented into distinct functional components: a light emitting diode chip mounted on a substrate, with a light transmitting member covering specific surfaces. This segmentation allows the device to achieve elongated light distribution while maintaining a compact overall structure through optimized component arrangement.
Solution Approach 2:
The patent utilizes the vertical dimension by having the light transmitting member cover the upper and side surfaces of the light emitting diode chip, creating a three-dimensional light distribution pattern. This dimensional approach allows broad light emission along the edge while keeping the device footprint compact.
2Volume of moving object
If the light emitting device is made compact to reduce size, then the device footprint is reduced, but light distribution uniformity deteriorates and dark spots may occur between adjacent devices
Solution Approach 1:
The light transmitting member is selectively positioned to cover the upper and side surfaces of the light emitting diode chip, creating localized light transmission zones. This local quality approach ensures uniform light distribution from each device while maintaining compact dimensions, preventing dark spots between adjacent devices through optimized local light emission characteristics.
3Area of stationary object
If adjacent light emitting devices are placed close together to maintain compact backlight module size, then the overall module size is reduced, but alignment precision requirements increase and dark spots may form in gaps between devices
Solution Approach 1:
The light transmitting member configuration enables each light emitting device to self-regulate its light output pattern, covering upper and side surfaces to create overlapping light fields that naturally fill gaps between adjacent devices. This self-service mechanism reduces sensitivity to alignment precision while maintaining compact backlight module size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances luminous efficacy by ensuring that light is effectively distributed across the light guide plate, reducing dark spots and maintaining a compact size, thereby improving the overall performance of the backlight module.
Implementation Method 1
a light emitting diode chip
Implementation Method 2
a white barrier member covering opposite long side surfaces of the light transmitting member and a lower surface of the light emitting diode chip
Implementation Method 3
a light transmitting member covering upper and side surfaces of the light emitting diode chip
Data Source
AI summary
A light emitting device includes a light emitting diode chip, a light transmitting member, a white barrier member, and a conductive adhesive member. The light emitting diode chip has a bump pad formed on the lower surface thereof. The light transmitting member covers the side surfaces and the upper surface of the light emitting diode chip, and the upper surface of the light transmitting member has a rectangular shape having long sides and short sides. The conductive adhesive member is formed to extend through the white barrier member from the bottom of the light emitting diode chip. The upper surface of the conductive adhesive member is connected to the bump pad of the light emitting diode chip, and the lower surface of the conductive adhesive member is exposed at the lower surface of the white barrier member.