Side View LED Package With Inclined Cavity Sidewall
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Solution Overview
Problem
Conventional LED packages with deeper sidewalls restrict beam angle, reduce light quantity due to light absorption/scattering, and are prone to molding defects, which degrade performance and require more packages and increased material usage.
Innovation Solution
A side view LED package design with an inclined cavity sidewall and reduced depth, where the cavity depth is larger than the LED chip mounting height but not exceeding six times of it, and wire bonding techniques to minimize wire height, allowing for efficient encapsulation and reduced light loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cavity depth is increased to accommodate wire loops and LED chip mounting, then the structural stability and electrical connection are improved, but the beam angle is restricted and light quantity is reduced
Solution Approach 1:
The patent transitions from a deep cavity structure to a shallow cavity structure by changing the dimensional proportions. The cavity depth is reduced to not exceed six times the LED chip mounting height, and the sidewall is inclined to distribute the structural space differently, thereby improving beam angle while maintaining structural stability through the inclined geometry.
Solution Approach 2:
The patent changes the cavity depth parameter from a large value (600-650 μm in conventional designs) to a controlled range (not exceeding six times the mounting height). This parameter change directly improves beam angle characteristics and light quantity while the inclined sidewall design compensates for structural stability.
2Reliability
If the cavity depth is increased to ensure proper encapsulation, then the encapsulation completeness is improved, but light absorption and scattering by sidewalls increase
Solution Approach 1:
The patent redistributes the encapsulation space by reducing cavity depth and inclining the sidewall, creating a more optimized three-dimensional configuration. This dimensional change reduces the path length of light through the encapsulant and minimizes sidewall interaction, thereby reducing light absorption and scattering while maintaining complete encapsulation.
Solution Approach 2:
The inclined sidewall introduces asymmetry into the cavity structure, optimizing the spatial arrangement of the encapsulant around the LED chip. This asymmetric design reduces the amount of encapsulant material that light must traverse, minimizing absorption and scattering losses while ensuring complete encapsulation of the LED chip.
3Strength
If the sidewall height is increased to provide structural support, then the mechanical strength is improved, but molding defects such as voids occur more frequently
Solution Approach 1:
The patent changes the sidewall height parameter from a large value to a reduced height (cavity depth not exceeding six times the mounting height). This parameter change reduces the likelihood of molding defects such as voids while the inclined sidewall design provides adequate structural support through optimized geometry and stress distribution.
Solution Approach 2:
The patent optimizes the structural support by changing from a vertical sidewall to an inclined sidewall configuration. This dimensional change in the sidewall geometry provides sufficient mechanical strength through the inclined structure while reducing the overall height, thereby minimizing molding defects during the injection molding process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves beam angle characteristics, increases light quantity by minimizing light absorption, and prevents molding defects, resulting in enhanced performance and reduced material waste.
Implementation Method 1
a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames
Implementation Method 2
a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip
Data Source
AI summary
A side view LED package for a backlight unit includes a package body having a cavity with an inclined inner sidewall, first and second lead frames arranged in the package body, the cavity of the package body exposing a portion of at least one of the first and second lead frames placed in a bottom of the cavity to outside, a light emitting diode chip mounted on the bottom of the cavity to be electrically connected to the first and second lead frames, and a transparent encapsulant arranged in the cavity surrounding the light emitting diode chip. The cavity has a depth larger than a mounting height of the light emitting diode chip and not exceeding six times of the mounting height. The height of the sidewall is shortened to improve beam angle characteristics of emission light, increase light quantity, and prevent a molding defect of the sidewall.