Side View LED Package with Nested Terminals
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Solution Overview
Problem
Conventional side view LED modules face challenges in reducing the distance between LED packages due to outer terminal and solder limitations, and CSP type LED units are not suitable for side view applications due to vertical wavelength converting layers and opposing light emission directions.
Innovation Solution
A side view LED package design featuring a CSP type LED unit with inclined wavelength converting layers and reflector surfaces, and a mount substrate configuration with angled C-shaped soldering patterns to minimize solder exposure and enhance bonding strength, allowing for improved luminance and stable mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If outer terminals extend outward from package bodies, then electrical connection is achieved, but distance between LED packages cannot be reduced
Solution Approach 1:
The patent inverts the conventional terminal arrangement by placing terminals underneath the package body instead of extending outward. This inversion allows the terminals to be positioned within the mounting area rather than occupying external space, enabling reduced distance between adjacent LED packages while maintaining electrical connection functionality.
Solution Approach 2:
The terminal structure is nested within the package body footprint, with terminals positioned underneath the main package structure. This nesting approach allows the electrical connection elements to be contained within the package's horizontal envelope, minimizing the space required between adjacent packages on the mount substrate.
2Length of moving object
If outer terminals are positioned underneath package bodies, then package distance is reduced, but solder fillet formation becomes difficult
Solution Approach 1:
The patent applies local quality by creating a concave depression in the terminal region that is specifically designed to accommodate solder fillet formation. This localized structural modification provides a favorable geometry for solder wetting and fillet development at the critical bonding interface, while the rest of the package maintains its compact form factor.
Solution Approach 2:
The concave depression in the terminal structure introduces a curved geometry that facilitates solder flow and fillet formation. The curved surface area of the concave region provides increased surface contact for solder wetting, enabling reliable fillet formation even with the terminals positioned underneath the package body.
3Illumination intensity
If wavelength converting layers have vertical side surfaces, then manufacturing is simplified, but reflector luminance enhancement is limited
Solution Approach 1:
The patent applies asymmetry by configuring the wavelength converting layer with inclined side surfaces rather than vertical ones. The asymmetric inclination angles are specifically designed to work with the reflector geometry, directing reflected light more effectively toward the emission direction and enhancing luminance output.
Solution Approach 2:
The patent changes the geometric parameters of the wavelength converting layer by introducing inclined surfaces with specific angle ranges. This parameter modification optimizes the interaction between the wavelength converting layer and the reflector, improving light extraction efficiency and luminance enhancement while maintaining manufacturing feasibility.
4Strength
If solder exposure area is increased for bonding, then bonding strength improves, but tilting problems occur
Solution Approach 1:
The patent applies preliminary action by providing guiding structures on the package body that engage with corresponding features on the mount substrate before solder bonding occurs. This preliminary mechanical guidance ensures proper alignment and prevents tilting during the bonding process, while still allowing sufficient solder exposure area for strong bonding.
Solution Approach 2:
The patent employs a composite bonding approach that combines mechanical guidance structures with solder bonding. The guiding structures provide alignment stability and prevent tilting, while the solder provides the bonding strength, creating a composite connection system that achieves both stability and strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables closer packing of LED packages, improved luminance, and prevents tilting issues, while maintaining robust electrical connections and efficient light emission.
Implementation Method 1
a side view LED package including a chip scale package (CSP) type LED unit
Implementation Method 2
the inner wall surfaces of a reflector surrounding the side surfaces of the wavelength converting layer are also inclined at a desired angle
Implementation Method 3
solder joints through which the terminals are electrically connected to the mount substrate
Data Source
AI summary
A side view LED module is disclosed. The side view LED module includes: a mount substrate; a side view LED package including an LED unit and a body including a first side to which the LED unit is bonded, a second side parallel to the first side, a third side orthogonal to the first and second sides and facing the mount substrate, and terminals formed on the first, second, and third sides; and solder joints through which the terminals are electrically connected to the mount substrate. Each of the terminals includes an opening formed at the second side and a concave electrode extending from the opening toward the first side and recessed relative to the third side. Each of the solders fills only a portion of an inner space of the corresponding concave electrode and includes a base portion formed on the third side and inner fillets extending upward along the inner wall surfaces of the concave electrode from the base portion.