Side-view LED Partition Wall Prevents Light Absorption
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Solution Overview
Problem
Conventional side view LEDs suffer from light absorption and scattering by protective devices like Zener diodes, leading to reduced light emitting efficiency and complex fabrication processes due to the coplanar disposition of these components.
Innovation Solution
A side view LED design featuring a partition wall between the LED chip and the protective device, with elongated lead frames and separate encapsulants to prevent light absorption and improve electrical connections, allowing for efficient light emission and simplified fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the protective device is coplanarly disposed with the LED chip, then the LED is protected from electrical abnormality, but light generated from the LED chip is absorbed or scattered by the protective device, degrading light emitting efficiency
Solution Approach 1:
The patent divides the package body into two separate mounting areas using a partition wall: one area for the LED chip and another for the protective device. This segmentation prevents light from the LED chip from being absorbed by the protective device while maintaining electrical protection functionality.
Solution Approach 2:
The partition wall acts as an intermediary structure that separates the LED chip and protective device spatially. It blocks light paths between the two components while allowing the package body to maintain structural integrity and electrical connections.
2Volume of moving object
If the LED chip and protective device are disposed in a narrow concave, then the package size is reduced, but the wires must be disposed at a predetermined gap to avoid contact, requiring meticulous process and undermining fabrication efficiency
Solution Approach 1:
The partition wall divides the package interior into distinct compartments, allowing wires to be routed independently in each section without risk of contact. This eliminates the need for precise gap control between wires while maintaining a compact overall package size.
Solution Approach 2:
The partition wall serves as a physical barrier that prevents wire contact between the LED chip and protective device mounting areas. This intermediary structure simplifies the fabrication process by eliminating the need for meticulous wire placement control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances light emitting efficiency by preventing light absorption and simplifies the fabrication process by maintaining efficient electrical connections without increasing the LED size.
Implementation Method 1
light generated from the LED chip is absorbed or scattered by the Zener diode 40
Implementation Method 2
Light L incident into the light guide plate 54 from the LEDs is reflected upward by a reflective sheet 56 or microdot patterns
Implementation Method 3
The Zener diode 40 operates in a breakdown area of the PN junction. Thus the Zener diode 40 is chiefly used for voltage regulation or to ensure a constant voltage. The Zener diode 40 obtains a predetermined voltage via a zener recovery phenomenon.
Implementation Method 4
a transparent encapsulant 14 provided into a cup-shaped concave 12 therearound
Data Source
AI summary
In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.