Side-View Light Emitting Device Thinning via Surface Mounting
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Solution Overview
Problem
Conventional side-view type light emitting devices face limitations in thinning due to the need for a certain thickness of the resin package and gap between the light emitting element and the cavity wall, which restricts their miniaturization for applications like displays and liquid crystal displays.
Innovation Solution
A side-view type light emitting device with a stacked semiconductor layer structure, where the light emitting device has a bottom surface as a light emission surface and one side surface for mounting, utilizing a resin layer to cover the semiconductor layers and connecting electrodes, eliminating the need for leads and gaps, allowing for reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a resin package with cavity and leads is used in conventional side-view type light emitting devices, then the device can be mounted and electrically connected, but the thickness cannot be reduced due to the required interval between the resin package surface and cavity surface
Solution Approach 1:
The patent extracts and eliminates the leads and the cavity structure from the conventional design. The light emitting element is mounted directly on the resin package surface without requiring leads to extend outside the package, removing the need for the interval between the surface and cavity
Solution Approach 2:
The patent changes the mounting configuration from a three-dimensional cavity structure to a surface-mounted configuration. The light emitting element is positioned on the surface of the resin package rather than inside a cavity, fundamentally changing the spatial arrangement and enabling thinning
2Length of moving object
If a cavity structure is used to mount the light emitting element, then the element can be securely positioned, but gaps must be maintained between the element and cavity wall which limits further thinning
Solution Approach 1:
The cavity structure is extracted and replaced with a surface mounting approach. The light emitting element is positioned directly on the resin package surface with electrodes extending to side surfaces, eliminating the cavity and the associated gap requirements
Solution Approach 2:
Instead of placing the light emitting element inside a cavity and having leads extend outward, the patent inverts the configuration by mounting the element on the surface and having the electrodes extend to the side surfaces, reversing the conventional arrangement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the light emitting device to be thinned significantly, reducing size and weight while maintaining light emission efficiency, suitable for compact and lightweight applications.
Implementation Method 1
a stacked semiconductor layer including a first semiconductor layer, an active layer and a second semiconductor layer which are stacked in that order from a side of the bottom surface
Data Source
AI summary
A side-view type light emitting device has a bottom surface thereof as a light emission surface and a first lateral surface thereof as a mounting surface for mounting on a mounting substrate, and includes a semiconductor layered structure including a first semiconductor layer, an active layer and a second semiconductor layer; a first connecting electrode exposed from the first lateral surface and electrically connected to the first semiconductor layer; a first electrode disposed between the first semiconductor layer and the first connecting electrode; a second connecting electrode exposed from the first lateral surface; a metal wire electrically connecting an upper surface of the second semiconductor layer to the second connecting electrode; and a resin layer. In a direction perpendicular to the light emission surface, the active layer does not overlap with the first connecting electrode, and the active layer does not overlap with the second connecting electrode.