Side View SMD LED with Opposing Contact Pins
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Solution Overview
Problem
Traditional side-view surface mount LEDs with all contact pins oriented in the same direction face challenges in accessibility and reliability, leading to unbalanced packages and increased manufacturing complexity, particularly in small or low-power display applications like cellular phones and personal digital assistants.
Innovation Solution
The design features a side-oriented package with contact pins protruding from a side of the package, where at least one pin is oriented opposite to the others, and includes a reflective encapsulant with a phosphor to enhance light output and mounting efficiency, along with tapered bond pads for improved electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all contact pins are oriented in the same direction, then the package structure is simple, but the mounting reliability decreases and accessibility is poor
Solution Approach 1:
The patent applies asymmetry by orienting at least one contact pin in the opposite direction to the other contact pins. This asymmetric configuration improves mounting reliability and accessibility without significantly increasing package complexity, as it only requires modifying the pin orientation arrangement rather than the overall package structure.
2Reliability
If contact pins are oriented in opposite directions, then mounting reliability improves, but the package structure becomes more complex
Solution Approach 1:
The patent applies local quality by making only the contact pin orientations different while keeping the rest of the package structure uniform. This localized variation provides the reliability benefits of opposite-direction pins without requiring complex changes to the entire package design.
3Ease of manufacture
If traditional LED packaging is used, then manufacturing is straightforward, but wire bonding is difficult and manufacturing complexity increases
Solution Approach 1:
The patent applies preliminary action by pre-configuring the contact pins to protrude from the package in opposite directions, which prepares the structure in advance for easier wire bonding. This preliminary configuration eliminates the need for complex wire bonding maneuvers during manufacturing, thereby reducing manufacturing complexity while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a more balanced and reliable mounting system with enhanced light output and manufacturing ease, reducing the risk of pin breakage and allowing for larger wire bond balls, thus improving the overall performance and efficiency of the LED devices.
Implementation Method 1
a plurality of light emitting diodes (LEDs) mounted on the floor
Implementation Method 2
a reflective encapsulant with a phosphor to enhance light output
Data Source
AI summary
A side view surface mount light emitting device is disclosed. The light emitting device comprises a side oriented package comprising a floor and a plurality of light emitting diodes (LEDs) mounted on the floor. The device further includes a plurality of contact pins in electrical contact, such that the plurality of contact pins protrude from a side of the package, in which at least one of the contact pins is oriented in a direction opposite the remaining contact pins. The LEDs of the device are disposed to emit light in a direction parallel to said mount surface. Some configurations also include a plurality of bond pads, on or a part of the floor, to facilitate electrical connection between the LEDs and the contact pins, in which adjacent bond pads have a tapered shape such that the widest portion of a first bond pad is adjacent to the narrowest portion of a second bond pad. Displays including such devices are also disclosed.