Side-Wall Heat Dissipation Structure for Rollable Electronics
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Solution Overview
Problem
Rollable electronic devices face challenges in securing a heat dissipation structure while maintaining miniaturization and portability, as components generate heat that can degrade performance and are difficult to dissipate effectively.
Innovation Solution
The electronic device incorporates a heat dissipation structure that transfers heat generated by electronic components in a width direction using a side wall member, with a first heat dissipation structure transferring heat to the side wall and a second structure dissipating it externally.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If integrated components are mounted in smaller spaces for high performance, then device performance is improved, but heat dissipation becomes more difficult
Solution Approach 1:
The patent transitions heat dissipation from a vertical path to a lateral path by utilizing the side wall member. Heat is transferred from electronic components to the side wall in the width direction, then dissipated through the side wall's external surface, effectively using the device's lateral dimension for thermal management.
Solution Approach 2:
The side wall member serves dual functions: providing structural support for the device and acting as a heat dissipation structure. This multi-functionality allows the same component to address both mechanical integrity and thermal management needs.
2Temperature
If a heat dissipation structure is added to transfer heat in width direction, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation function with the existing side wall member structure. Rather than adding a separate dedicated heat dissipation component, the design merges thermal management capabilities into the structural side wall, reducing overall device complexity.
Solution Approach 2:
The side wall member is designed to perform both structural support and heat dissipation functions simultaneously, eliminating the need for separate dedicated heat dissipation structures and thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively diffuses heat generated by components in a widthwise direction, ensuring efficient heat dissipation and maintaining device performance while preserving portability and compact size.
Implementation Method 1
a first heat dissipation structure configured to transfer at least some of heat from the at least one electronic component to the side wall
Implementation Method 2
a second heat dissipation structure configured to dissipate the at least some of heat transferred by the first heat dissipation structure
Implementation Method 3
a second heat dissipation structure configured to dissipate the at least some of heat transferred by the first heat dissipation structure
Data Source
AI summary
An electronic device is provided, which may include at least one housing including a first housing and a second housing, wherein the first housing is movable relative to the second housing; a circuit board disposed in the at least one housing; at least one electronic component disposed on the circuit board; a side wall including a first surface and a second surface opposite to the first surface, wherein the first surface is facing at least a portion of the circuit board; a first heat dissipation structure configured to transfer at least some of heat from the at least one electronic component to the side wall; and a second heat dissipation structure configured to dissipate the at least some of heat transferred by the first heat dissipation structure.