Side-Wall Circuit Panel Wiring for High-Density Bezel-Less Connections
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Solution Overview
Problem
Conventional methods for electrically connecting the surfaces of circuit panels, such as FPCBs, face challenges in achieving high-density connections and bezel-less designs due to bending radius limitations and adherence issues, especially when forming intricate wiring between the top and bottom sides of densely integrated circuit layers.
Innovation Solution
A method involving the formation of side wiring on circuit panels using an anisotropic conductive layer and conductive patterns on a side film to connect upper and lower electrodes, allowing for flexible substrate materials and enabling connections without the need for expensive equipment, with applications in LED backlight substrates and micro LED displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If conventional FPCB is used to connect surface and back of panel, then electrical connection is achieved, but bending radius limitation prevents bezel-less designs and tight adherence
Solution Approach 1:
The patent transitions from planar surface connections to side-wall connections by forming conductive patterns on the vertical sidewalls of the panel. This dimensional change allows electrical connections to be made through the side walls rather than requiring bending of FPCB, enabling bezel-less designs and tight panel adherence while maintaining electrical connectivity between front and back surfaces.
2Reliability
If side wall wiring is formed using conventional methods, then electrical connection is achieved, but expensive equipment is required
Solution Approach 1:
The patent changes the manufacturing parameters by using screen printing technology with paste materials instead of conventional expensive side wall wiring equipment. The conductive patterns are formed by printing paste on sidewalls, followed by sintering at relatively low temperatures (700-900°C), which significantly reduces manufacturing costs while maintaining reliable electrical connections.
3Productivity
If high density wiring is formed on both sides of panel, then circuit integration is improved, but precision wiring formation becomes more difficult
Solution Approach 1:
The patent replaces conventional mechanical wiring formation methods with screen printing technology. The screen printing process uses a mesh template to precisely deposit conductive paste patterns on sidewalls, enabling high-density wiring formation with excellent precision. The sintering process then consolidates the printed patterns into reliable conductive paths, achieving both high integration density and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable, high-density electrical connections between circuit layers on both sides of the panel, reducing resistance and signal interference, and facilitating bezel-less designs without the need for costly equipment, suitable for applications like LED backlight substrates and micro LED displays.
Implementation Method 1
an anisotropic conductive layer is used to connect the conductive patterns to at least one of the upper electrodes and the lower electrodes
Implementation Method 2
electrically connecting the upper electrodes and the lower electrodes using the conductive patterns
Implementation Method 3
adhering the side film to the upper side, a side wall and a lower side of the substrate
Data Source
AI summary
A circuit panel having side wirings comprises a substrate which includes a first circuit formed on a top surface of the substrate and a plurality of upper electrodes formed on one side of the top surface of the substrate corresponding to the first circuit, a side film adhered to the top surface, a side wall and a bottom surface of the substrate, with a plurality of conductive patterns formed parallel to each other on the side film, and a second circuit a plurality of lower electrodes connected to the conductive patterns to communicate with the first circuit, wherein an anisotropic conductive layer of the side film connect the conductive patterns to at least one of the upper electrodes and the lower electrodes.