Side-Wired Display Pad Layout for Misalignment-Tolerant Connections
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Solution Overview
Problem
Existing display devices face issues with positional deviations in connection pads and side wiring due to misalignment and resolution limits, leading to increased resistance, lower manufacturing yield, and uneven luminance or color in display images.
Innovation Solution
A display device design featuring first and second connection pads of different sizes, connected by a side wire, which accommodates positional deviations and improves connectivity, thereby enhancing manufacturing yield and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If connection pads and side wiring are formed with standard alignment processes, then manufacturing process is simple, but positional deviations occur leading to increased resistance and lower manufacturing yield
Solution Approach 1:
The connection pads are designed with asymmetric sizes - a first connection pad on the first surface and a second connection pad on the second surface with different dimensions. This asymmetric design allows the side wire to accommodate positional deviations more effectively, as the larger pad provides a broader connection area that can tolerate misalignment, thereby improving manufacturing precision without requiring overly complex alignment processes
Solution Approach 2:
The invention anticipates positional deviations by designing the connection pads with different sizes beforehand. The size difference acts as a buffer or cushion that absorbs the impact of misalignment, ensuring that even when positional deviations occur during manufacturing, the electrical connection remains reliable with acceptable resistance levels
2Reliability
If connection pads are made the same size, then manufacturing process is simplified, but positional deviations cause increased resistance and lower yield
Solution Approach 1:
Instead of making both connection pads the same size, the invention uses asymmetric sizing where the first and second connection pads have different dimensions. This approach maintains ease of manufacture through standard photolithography processes while improving electrical connection reliability, as the size difference provides tolerance for positional deviations
3Manufacturing precision
If standard alignment processes are used, then manufacturing cost is low, but positional deviations lead to uneven luminance and color in display images
Solution Approach 1:
The asymmetric connection pad design allows standard alignment processes to achieve better effective precision. By having different sized pads, the system can tolerate larger positional deviations without failure, effectively increasing the manufacturing yield without requiring more precise (and costly) alignment processes
Solution Approach 2:
The invention prepares for potential alignment issues by designing pads with different sizes that create a buffer zone. This beforehand cushioning ensures that even when positional deviations occur during standard manufacturing processes, the electrical connection remains stable, preventing defects that would reduce productivity
Data Source
AI summary
A display device includes a substrate including a first surface, a side surface, and a second surface opposite to the first surface, a pixel unit located on the first surface and including a light emitter, a first connection pad adjacent to an edge on the first surface and electrically connected to the pixel unit, a second connection pad adjacent to the edge on the second surface, and a side wire extending from the first surface through the side surface to the second surface and connecting the first connection pad and the second connection pad. The first connection pad and the second connection pad have different sizes.