Side Wiring Structure for Low-Resistance Surface-to-Surface Conduction
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Solution Overview
Problem
Existing electronic devices face challenges in ensuring efficient electric transmission between surfaces of various dimensions due to high contact resistance at the interfaces of conductive elements.
Innovation Solution
The electronic device incorporates a substrate structure with a first conductive element, a second conductive element, a third conductive element, and a side wiring, where the side wiring and the second conductive element are made of the same material, and an auxiliary bonding pad is introduced to increase the contact area, reducing resistance through a metallic bond enhancement process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional conductive elements are used to connect surfaces of various dimensions, then the device structure is simple, but high contact resistance occurs at the interfaces
Solution Approach 1:
The conductive connection is divided into multiple segments: a first conductive element on the first surface, a second conductive element on the first conductive element, a third conductive element on the second surface, and a fourth conductive element on the third conductive element. This segmentation allows optimization of each interface separately to reduce contact resistance.
Solution Approach 2:
A side wiring is introduced that extends along the side surface of the substrate structure, providing an additional dimensional path for electrical connection. This side wiring connects the second conductive element and the fourth conductive element, creating a three-dimensional conductive network that reduces contact resistance at critical interfaces.
2Reliability
If the contact area between conductive elements is increased, then contact resistance is reduced, but the device structure becomes more complex
Solution Approach 1:
The side wiring, second conductive element, and fourth conductive element are merged into a single continuous conductive structure comprising at least one same material. This merging ensures excellent metallic bonding and reduces contact resistance by eliminating material interfaces at the connections.
Solution Approach 2:
The conductive system uses composite material configuration where the side wiring and conductive elements are formed from the same material (such as metal materials like aluminum or copper), creating a homogeneous conductive path that minimizes interfacial contact resistance while maintaining structural integrity.
Data Source
AI summary
An electronic device includes a substrate structure, a first conductive element, a second conductive element, a third conductive element, a fourth conductive element, and a side wiring. The substrate structure has a first surface, a second surface and a side surface connected between the first surface and the second surface. The first conductive element is disposed on the first surface of the substrate structure. The second conductive element is disposed on the first conductive element. The third conductive element is disposed on the second surface of the substrate structure. The fourth conductive element is disposed on the third conductive element. The side wiring is disposed on the side surface of the substrate structure and in contact with the second conductive element and the fourth conductive element. The side wiring, the second conductive element, and the fourth conductive element comprise at least one same material.