Semiconductor Package Sidewall Conductor Structure for Compact Reliability

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Solution Overview

Problem

Existing semiconductor packages and manufacturing methods are inadequate, leading to excess cost, decreased reliability, relatively low performance, and oversized packages.

Innovation Solution

The semiconductor device comprises an electronic device and a substrate with a dielectric and conductive structure, where the substrate is designed to provide protection and electrical coupling while optimizing size and performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing is simpler, but cost increases and reliability decreases

Engineering Contradiction:

Improvepackage reliabilityVSAvoidmanufacturing complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The package structure is divided into distinct functional layers including die attach layer, mold compound layer, and lead frame sections, allowing each segment to be optimized independently for reliability while maintaining manufacturing feasibility through modular assembly processes

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The package employs composite material construction with dielectric materials, conductive materials, and protective coatings combined in a multi-layer structure, enhancing reliability through material synergies while using established composite manufacturing techniques to manage complexity

Inventive Principle:

Principle #40Composite materials

2Reliability

If conventional semiconductor packages are used, then design is simpler, but performance decreases

Engineering Contradiction:

Improvedevice performanceVSAvoidpackage structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The package design transitions to a three-dimensional stacked architecture with vertical interconnections and multi-layer routing, enabling enhanced performance through increased integration density while managing structural complexity through systematic layering and standardized interconnect protocols

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If conventional semiconductor packages are used, then manufacturing is easier, but package size becomes too large

Engineering Contradiction:

Improvepackage sizeVSAvoidmanufacturing difficulty

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The package structure implements nested arrangements where smaller functional components are embedded within larger package layers, including embedded capacitors within the mold compound and integrated heat sinks within the lead frame, reducing overall package size while using established embedding and molding techniques to maintain manufacturability

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS12288728B2Semiconductor device and method of manufacturing a semiconductor device

Publication Date: 2025.04.29 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, a semiconductor device can comprise (a) an electronic device comprising a device top side, a device bottom side opposite the device top side, and a device sidewall between the device top side and the device bottom side, (b) a first conductor comprising, a first conductor side section on the device sidewall, a first conductor top section on the device top side and coupled to the first conductor side section, and a first conductor bottom section coupled to the first conductor side section, and (c) a protective material covering the first conductor and the electronic device. A lower surface of the first conductor top section can be higher than the device top side, and an upper surface of the first conductor bottom section can be lower than the device top side. Other examples and related methods are also disclosed herein.