Sidewall Liquid Cooling Layout to Prevent Chassis Pipe Interference
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Solution Overview
Problem
Current cold plate liquid cooling schemes in data centers face issues with heat dissipation reliability due to liquid leakage risks from welding or clamping connections, piping layout interference with hardware, and maintainability challenges from movable quick connectors and hoses.
Innovation Solution
A liquid-cooling heat dissipation device with evaporators and condensers on the exterior sidewall, vapor and liquid pipelines, and a condenser-cold plate system that eliminates quick connectors, allowing vaporization and condensation for efficient heat dissipation without occupying internal space, and a dedicated cabinet for enhanced maintainability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If cold plate liquid cooling scheme is adopted with welding or clamping connections, then heat dissipation efficiency is improved, but liquid leakage risk increases
Solution Approach 1:
The patent replaces the mechanical welding or clamping connection system with a magnetic connection system. The magnetic connection device uses magnetic attraction forces to securely join the cold plate to the heat dissipation component, eliminating the need for welding or clamping while providing reliable liquid-tight sealing. This substitution maintains the integrity of the liquid cooling system without the leakage risks associated with traditional mechanical connections.
2Ease of repair
If quick connectors and hoses are used for maintenance, then ease of maintenance is improved, but liquid leakage risk increases during operation
Solution Approach 1:
The patent extracts and removes the quick connectors and hoses from the liquid cooling system. By eliminating these movable connection components, the system achieves permanent, sealed connections that prevent liquid leakage during long-term operation. Maintenance is performed by draining and refilling the liquid coolant rather than disconnecting components, thus maintaining reliability while still allowing for serviceability.
3Temperature
If pipelines exit from front or rear of chassis, then heat dissipation function is achieved, but interference with hard drives or IO ports occurs
Solution Approach 1:
The patent changes the spatial dimension of pipeline routing by transitioning from horizontal routing (front or rear exits) to vertical routing through the side wall of the chassis. This dimensional change allows the vapor and liquid pipelines to pass through the side wall in a direction that does not interfere with hard drives located at the front or IO ports located at the rear, thus achieving heat dissipation functionality while preserving full access to all hardware components.
4Device complexity
If conventional cold plate liquid cooling is used, then heat dissipation reliability is compromised, but device complexity is reduced
Solution Approach 1:
The patent merges the connection function and sealing function into a single integrated magnetic connection device. This unified component simultaneously provides mechanical attachment and liquid-tight sealing, eliminating the need for separate connection mechanisms and reducing the number of potential failure points. The integration of these functions maintains or reduces device complexity while significantly improving heat dissipation reliability through leak-free connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides reliable, efficient heat dissipation with reduced liquid leakage risks, maintains system aesthetics, and facilitates easy maintenance by eliminating the need for quick connectors, ensuring optimal system performance and appearance.
Implementation Method 1
liquid inside the evaporator absorbs heat emitted by the heat-generating electronic component and vaporizes into vapor
Implementation Method 2
returns to the evaporator along the liquid pipeline after being cooled into liquid by the condenser
Data Source
AI summary
A liquid-cooling heat dissipation device includes a pipeline outlet formed on an exterior sidewall of a chassis, wherein the exterior sidewall is an exterior wall of side panel in contact with a chassis panel and an IO port panel of the chassis, a circuit board fixed on an inner bottom surface of the chassis, an evaporator fixed on the circuit board with a preset gap, forming an accommodating space with the circuit board, a heat-generating electronic component mounted on the circuit board within the accommodating space, electrically connected to the circuit board and thermally connected to the evaporator, a condenser fixed to the exterior sidewall where the pipeline outlet is located, and a vapor pipeline and a liquid pipeline pass through the pipeline outlet, connecting the evaporator and the condenser.