Sidewall-Protected Conductive Members Against Etch Corrosion
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Solution Overview
Problem
The challenge in semiconductor manufacturing is the increased complexity and reliability issues due to galvanic corrosion during etching processes, leading to loss and structural weakness of conductive members with narrow widths.
Innovation Solution
A semiconductor structure is developed with a protective layer on the sidewall of a conductive member, comprising a seed layer, core, and protective layer, which mitigates galvanic corrosion and reduces the undercut, enhancing the structural integrity and reliability of the conductive member.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the conductive member width is reduced to increase integration density, then more components can be integrated into a given area, but galvanic corrosion during etching processes increases causing loss and structural weakness of the conductive member
Solution Approach 1:
A protective layer is introduced as an intermediary between the conductive member core and the etching environment. This protective layer acts as a mediator that prevents direct contact between the conductive member and corrosive etchants, thereby eliminating galvanic corrosion while allowing the conductive member to maintain narrow dimensions for high integration density
Solution Approach 2:
The conductive member is transformed from a single-material structure to a composite structure consisting of a core (conductive material) and a protective layer (corrosion-resistant material). This composite structure combines the electrical conductivity of the core material with the corrosion resistance of the protective layer, enabling narrow widths without sacrificing reliability
2Productivity
If the conductive member width is reduced, then integration density increases, but the conductive member becomes more susceptible to collapse or fracture
Solution Approach 1:
The protective layer serves as a structural intermediary that reinforces the narrow conductive member. By providing external support and protection, the protective layer prevents collapse or fracture of the thin conductive member while allowing it to maintain the narrow width necessary for high integration density
Solution Approach 2:
The composite structure of core plus protective layer creates a stronger overall construction. The protective layer acts as a structural shell that prevents buckling and fracture of the narrow core, enabling the conductive member to withstand mechanical stresses at reduced dimensions
3Reliability
If a protective layer is added to prevent galvanic corrosion, then reliability of the conductive member improves, but device complexity increases
Solution Approach 1:
The corrosion protection function is extracted from the conductive member core and placed into a separate protective layer. This separation allows the core to focus on electrical conductivity while the protective layer handles corrosion resistance, simplifying the design logic even though it adds a layer to the structure
Solution Approach 2:
The protective layer serves multiple functions simultaneously: it provides corrosion protection during etching, acts as a structural reinforcement to prevent collapse, and can serve as a barrier to diffusion. This multi-functionality reduces the need for additional separate structures, offsetting the complexity increase
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The protective layer prevents galvanic corrosion, maintaining the strength and reliability of the conductive member, thereby reducing the risk of collapse or fracture, and improving the overall reliability of the semiconductor structure.
Implementation Method 1
the protective layer mitigates galvanic corrosion during an etching process, thereby reducing or eliminating loss of the core due to the galvanic corrosion
Data Source
AI summary
The present application provides a semiconductor structure including a substrate and a conductive member over the substrate. The conductive member includes a seed layer over the substrate, a core disposed over the seed layer, and a protective layer disposed on a top surface of the core and surrounding a sidewall of the core. A method of manufacturing a semiconductor structure is also disclosed.