Semiconductor Package Sidewall Resin for Ultrasonic Wire Bond Stability
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Solution Overview
Problem
In semiconductor device manufacturing, the existing methods face challenges in preventing the deformation of stacked NAND flash memory chip packages and ensuring reliable connections between semiconductor elements, particularly when high-aspect-ratio semiconductor elements are used, as they tend to move during bonding wire formation due to ultrasonic vibration, leading to reduced reliability and flatness issues.
Innovation Solution
A semiconductor device design and manufacturing method that incorporates a first resin composition on the side surfaces of semiconductor elements to prevent movement during bonding wire formation, ensuring stable connections and high flatness by applying the resin composition strategically to prevent rotation and movement caused by ultrasonic vibration, while maintaining the integrity of the semiconductor device structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If high-aspect-ratio semiconductor elements are used, then device integration density is improved, but the elements move during bonding wire formation due to ultrasonic vibration, reducing reliability
Solution Approach 1:
The resin composition is applied to the side surfaces of semiconductor elements before bonding wire formation, creating a protective layer that prevents movement during the subsequent ultrasonic vibration process. This preliminary action stabilizes the elements before the harmful vibration occurs.
Solution Approach 2:
The resin composition acts as an intermediary substance between the semiconductor elements and the bonding wires, providing a stabilizing interface that prevents direct movement of the elements during wire formation while still allowing reliable electrical connection.
2Volume of moving object
If high-aspect-ratio semiconductor elements are used, then device integration density is improved, but flatness of the elements deteriorates
Solution Approach 1:
The resin composition forms a thin film layer on the side surfaces of semiconductor elements, providing mechanical support and stabilization that maintains flatness while accommodating the high-aspect-ratio structure needed for high integration density.
3Reliability
If resin composition is applied to side surfaces of semiconductor elements, then movement during bonding wire formation is prevented, but device structure complexity increases
Solution Approach 1:
The resin composition is applied selectively only to the side surfaces of semiconductor elements where it is most needed for stabilization, rather than coating the entire device. This localized application prevents movement while minimizing added structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the reliability of bonding wires and improves the flatness of semiconductor elements, contributing to the overall reliability and yield of the semiconductor device by stabilizing high-aspect-ratio semiconductor elements and preventing deformation of the package.
Implementation Method 1
high-aspect-ratio semiconductor elements are used, as they tend to move during bonding wire formation due to ultrasonic vibration
Data Source
AI summary
A semiconductor device includes a wiring board including first and second surfaces opposite to each other, a first semiconductor element on the first surface side of the wiring board, a second semiconductor element adjacent to the first semiconductor element on the first surface side of the wiring board, a first resin composition on the first surface side of the wiring board, and a second resin composition that covers the first and second semiconductor elements and the first resin composition. The first resin composition includes a first part between the first surface of the wiring board and a surface of the first semiconductor element facing the first surface, and a second part contacting a first side surface of the second semiconductor element facing the first semiconductor element.