Sidewall Spacer Structure for Self-Aligned Contact Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
As semiconductor devices shrink, the distance between the transistor gate and its associated source/drain contact decreases, leading to increased risks of electrical shorts and parasitic effects due to misalignment during the contact hole etch process.
Innovation Solution
The implementation of a second set of sidewall spacers formed above the first set of sidewall spacers on the gate electrode, increasing the distance between the gate electrode and the source/drain contact, thereby reducing the risk of electrical shorts and parasitic effects by maintaining a wider spacing even during misaligned etching.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the distance between gate and source/drain contact is reduced to shrink unit cell size, then device integration density is improved, but the risk of electrical shorts and parasitic effects increases
Solution Approach 1:
The gate electrode is divided into multiple segments along its length, with source/drain contacts formed at different locations relative to each segment. This segmentation allows the gate to maintain electrical connection with multiple contacts while preventing direct shorting between adjacent contacts, as each segment is electrically isolated from its neighbors by the insulating gate dielectric layer.
Solution Approach 2:
An insulating gate dielectric layer is introduced as an intermediary between the conductive gate electrode and the source/drain contacts. This dielectric layer prevents direct electrical contact (shorting) between the gate and contacts while still allowing the gate to exert control over the source/drain regions through electrical field effects, thus maintaining reliability while enabling close spacing.
2Productivity
If the distance between gate and source/drain contact is reduced, then unit cell size is decreased, but misalignment during contact hole etch process causes parasitic effects
Solution Approach 1:
The gate electrode and gate dielectric layer are formed beforehand, establishing precise registration marks and alignment references before the contact hole etch process. This preliminary formation of the gate structure provides fixed reference points that guide subsequent contact alignment, ensuring that even when contacts are formed at reduced distances, they remain properly positioned relative to the gate segments.
Solution Approach 2:
By dividing the gate into segments, the patent creates distinct registration zones for each contact. Each contact can be independently aligned to its corresponding gate segment, reducing the cumulative alignment errors that would affect a continuous gate structure. This segmentation approach allows for more tolerant manufacturing processes while maintaining the reduced unit cell dimensions.
Data Source
AI summary
A semiconductor device and method for fabricating such a device are presented. The semiconductor device includes a first gate electrode of a transistor, a first sidewall spacer along a sidewall of the gate pattern, a first insulating layer in contact with the first sidewall spacer and having a planarized top surface, and a second sidewall spacer formed on the planarized top surface of the first insulating layer. The second sidewall spacer may be formed over the first sidewall spacer. A width of the second sidewall spacer is equal to or greater than a width of the first sidewall spacer.


